BS CECC17000(1992) : 1992 AMD 9626
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - GENERIC SPECIFICATION - SOLID STATE ALL OR NOTHING RELAYS - GENERIC DATA AND METHODS OF TEST
15-10-1997
23-11-2012
Foreword
Preface
Section 1 - Scope
Section 2 - General
2.1 Order of precedence
2.2 Related documents
2.3 Units, symbols and terminology
2.4 Preferred values
2.5 Marking
Section 3 - Terms and definitions
3.1 Construction
3.2 Type of relays
3.3 General terms
3.4 Prefixes for the values applicable to relays
3.5 Control signal values
3.6 Output values
3.7 Terms relating to times
Section 4 - Quality assessment procedures
4.1 Primary stage of manufacture
4.2 Structurally similar components
4.3 Qualification approval procedure
4.4 Quality conformance inspection
4.5 Division into groups
4.6 Resubmission of rejected lots
4.7 Certified test records
4.8 Delivery of relays subjected to tests
4.9 Delayed delivery
4.10 Supplementary procedures for deliveries
4.11 Unchecked parameters
4.12 Release for delivery before the completion of
Group B tests
Section 5 - Test and measurement procedure
5.1 General
5.2 Alternative methods
5.3 Precision of measurement
5.4 Requirements in detail specifications
5.5 Standard conditions for testing
5.6 Visual inspection and check of dimensions
5.7 Mass
5.8 Terminal identification
5.9 'Must operate' and 'Must release' control signal
current and voltage ION, VON, VO
5.10 Peak on-state voltage VTM
5.11 Zero turn-on voltage VTO
5.12 Surge (Non-repetitive) on-state current ITSM
5.13 Surge (Non-repetitive) on-state current ITSM
(with rapid rate of rise of reverse voltage)
5.14 Critical rate of rise of on-state current dI/dt
5.15 Critical rate of rise of commutating voltage dV/dt
5.16 Critical rate of rise of off-state voltage dV/dt
5.17 Off-state current ID
5.18 Repetitive peak off-state voltage VDRM
5.19 Non-repetitive peak off-state voltage VDSM
5.20 Input circuit resistance
5.21 Dielectric test
5.22 Insulation resistance
5.23 Climatic sequence
5.24 Damp heat steady state
5.25 Rapid change of temperature
5.26 Accelerated thermal cycling
5.27 Enclosure
5.28 Corrosive atmosphere
5.29 Mould growth
5.30 Robustness of terminals
5.31 Soldering
5.32 Shock
5.33 Bump
5.34 Vibration
5.35 Acceleration
5.36 Electrical endurance
5.37 Thermal endurance
5.38 Voltage blocking
5.39 Resistance to solvents
5.40 Fire Hazard
5.41 Radio frequency interference (under consideration)
Lists measurement and test procedures to be used in sectional and/or detail specifications for solid state all or nothing relays, and specifies the quality assurance procedures to be followed. AMD 9626 RENUMBERS THIS STANDARD
| Committee |
ECL/1
|
| DevelopmentNote |
Renumbered and superseded by BS EN 117000. Supersedes 80/30638 DC. (08/2005)
|
| DocumentType |
Standard
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| CECC 17000 : 1990 | Similar to |
| CECC 00109 : 1974 | CECC RULES OF PROCEDURE: RP 9: CERTIFIED TESTS RECORDS |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60695-2-1:1991 | Fire hazard testing - Part 2: Test methods - Section 1: Glow-wire test and guidance |
| IEC 60068-2-27:2008 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 60068-2-13:1983 | Basic environmental testing procedures - Part 2-13: Tests - Test M: Low air pressure |
| IEC 60068-2-11:1981 | Basic environmental testing procedures - Part 2-11: Tests - Test Ka: Salt mist |
| IEC 60027-1:1992 | Letters symbols to be used in electrical technology - Part 1: General |
| IEC 60410:1973 | Sampling plans and procedures for inspection by attributes |
| IEC 60068-2-3:1969 | Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state |
| CECC 50000 : 86 AMD 3 | SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: GENERIC SPECIFICATION FOR DISCRETE SEMICONDUCTOR DEVICES |
| ISO 8601:2004 | Data elements and interchange formats Information interchange Representation of dates and times |
| IEC 60050-446:1983 | International Electrotechnical Vocabulary (IEV) - Part 446: Electrical relays |
| IEC 60068-2-17:1994 | Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing |
| IEC 60068-2-10:2005 | Environmental testing - Part 2-10: Tests - Test J and guidance: Mould growth |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC 60255-1-00:1975 | Electrical relays. All-or-nothing electrical relays. *Note.-This publication supersedes IEC 255-1 (1967) and 255-2 (1969) |
| IEC 60255-5:2000 | Electrical Relays - Part 5: Insulation coordination for measuring relays and protection equipment - Requirements and tests |
| IEC 60748-1:2002 | Semiconductor devices - Integrated circuits - Part 1: General |
| IEC 60068-2-29:1987 | Environmental testing. Part 2: Tests. Test Eb and guidance: Bump |
| IEC 60443:1974 | Stabilized supply apparatus for measurement |
| IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| IEC 60144:1963 | Degrees of protection of enclosures for low-voltage switchgear and controlgear |
| IEC 60050-521:2002 | International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits |
| IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| CECC 00007 : 1978 | BASIC SPECIFICATION: SAMPLING PLANS AND PROCEDURES FOR INSPECTION BY ATTRIBUTES |
| CECC 19000 : 78 AMD 2 | GENERIC SPECIFICATION: DRY REED MAKE CONTACTS UNITS |
| IEC 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
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