BS EN 123300:1992
Current
The latest, up-to-date edition.
Specification for harmonized system of quality assessment for electronic components. Sectional specification. Multilayer printed boards
Hardcopy , PDF
English
31-08-1989
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Foreword
Preface
1. Introduction
1.1 Scope and object
1.2 Related documents
2. General
3. Test specimens
3.1 Capability approval
3.2 Quality conformance inspection
4. Relevant specification
5. Characteristics of printed boards
Table I
Table II
6. Capability test programme
7. Quality conformance inspection
8. Test patterns
8.1 Application of test patterns and test boards
8.2 Composite test pattern (CTP)
8.3 Structure of test boards
8.4 Multiple arrangements of the CTP
Figure 2 - Composite test pattern
Figure 3 - Examples of soldered holes
Defines the characteristics to be assessed and the test methods to be used for capability approval testing and quality conformance inspection.
| Committee |
EPL/501
|
| DevelopmentNote |
Renumbers and supersedes BS CECC23300(1989). 1992 Version incorporates amendment 7364 to BS CECC23300(1989). Supersedes 86/31650 DC and 94/216046 DC. (09/2005)
|
| DocumentType |
Standard
|
| Pages |
40
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| CECC 23300 : 85 AMD 1 | Identical |
| DIN EN 123300:1992-11 | Identical |
| EN 123300 : 1992 AMD 1 1995 | Identical |
| NEN EN 123300 : 1995 AMD 1 1995 | Identical |
| SN EN 123300 : AMD 1 1995 | Identical |
| I.S. EN 123300:1994 | Identical |
| BS CECC 23300-003:1996 | Harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards |
| CECC 00107(PT3) : 80 AMD 1 | CECC RULES OF PROCEDURE: RP7: QUALITY ASSESSMENT PROCEDURES - PROCEDURE FOR CAPABILITY APPROVAL |
| BS CECC23000(1989) : 1989 AMD 7145 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: GENERAL SPECIFICATION: PRINTED BOARDS |
| CECC 00010 : 1980 AMD 1 | BASIC SPECIFICATION: TEST METHODS FOR PRINTED BOARDS |
| CECC 00107(PT2) : 79 AMD 1 | CECC RULES OF PROCEDURE: RP7: QUALITY ASSESSMENT PROCEDURES - PROCEDURE FOR ENHANCED ASSESSMENT OF QUALITY |
| BS 6221-2:1991 | Printed wiring boards Methods of test |
| CECC 00107(PT1) : 1982 | CECC RULES OF PROCEDURE: RP7: QUALITY ASSESSMENT PROCEDURES - QUALITY ASSESSMENT PROCEDURE FOR GENERAL USAGE |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| CECC 00111 : 80 AMD 3 | CECC RULES OF PROCEDURE: RP 11: SPECIFICATIONS AND THEIR HARMONIZATION - COMPONENTS FOR GENERAL AND PROFESSIONAL USAGE - COMPONENTS OF ENHANCED ASSESSMENT OF QUALITY |
| BS 4584:1970 | Specification for metal clad base materials for printed circuits. Methods of test |
| IEC 60326-3:1991 | Printed boards - Part 3: Design and use of printed boards |
| BS 2011(1967) : LATEST |
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