BS EN 60068-2-54:2006
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Environmental testing Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
Hardcopy , PDF
31-07-2017
English
29-09-2006
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General description of the test
5 Description of the test apparatus
5.1 Test system
5.2 Solder bath
6 Preconditioning
6.1 Preparation of specimens
6.2 Ageing
7 Materials
7.1 Solder
7.2 Flux
8 Procedure
8.1 Test temperature
8.2 Fluxing
8.3 Flux drying
8.4 Test
9 Presentation of results
9.1 Form of chart-recorder trace
9.2 Points of significance
9.3 Reference wetting force
9.4 Test requirements
10 Information to be given in the relevant specification
Annex A (normative) Equipment specification
Annex B (informative) Guide to the use of the wetting balance
for solderability testing
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Bibliography
Describes Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability.
| Committee |
EPL/501
|
| DevelopmentNote |
Supersedes BS 2011-2.1TA(1989) (09/2006)
|
| DocumentType |
Standard
|
| Pages |
22
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
IEC 60068-2-54:2006 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This second edition cancels and replaces the first edition, published in 1985 and constitutes a technical revision. The major technical changes with regard to the previous edition concern: - the addition of lead free solder alloy (see Clause 7, Materials); - reversal of force-time curves to align with IEC 60068-2-69 (see Figure 2 and Figure B.1); - modification to the test requirement for progress of wetting (see Clause 9).
| Standards | Relationship |
| UNE-EN 60068-2-54:2007 | Identical |
| IEC 60068-2-54:2006 | Identical |
| SN EN 60068-2-54 : 2006 | Identical |
| DIN EN 60068-2-54:2007-01 | Identical |
| I.S. EN 60068-2-54:2006 | Identical |
| EN 60068-2-54:2006 | Identical |
| NBN EN 60068-2-54 : 2007 | Identical |
| DEFSTAN 61-12(PT12)SEC3/2(2008) : 2008 | WIRES, CORDS AND CABLES - ELECTRICAL-METRIC UNITS - PART 12 SECTION 3: CABLES, TELEPHONE (FOR FIELD USE) |
| HD 323.2.20 : 200S3 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| EN 61190-1-3:2007/A1:2010 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| IEC 60068-2-44:1995 | Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering |
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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