BS EN 60191-6-21:2010
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
Hardcopy , PDF
English
31-12-2010
Foreword
1 Scope
2 Normative references
3 Terms and definitions
4 Measuring methods
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Defines methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.
Committee |
EPL/47
|
DevelopmentNote |
Supersedes 08/30190030 DC. (12/2010)
|
DocumentType |
Standard
|
Pages |
18
|
PublisherName |
British Standards Institution
|
Status |
Current
|
Supersedes |
This part of IEC 60191 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.
Standards | Relationship |
EN 60191-6-21 : 2010 | Identical |
IEC 60191-6-21:2010 | Identical |
IEC TR 62453-62:2017 | Identical |
EN 61557-5:2007 | Identical |
IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
IEC 60191-4:2013 | Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages |
EN 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
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