BS EN 62137-3:2012
Current
The latest, up-to-date edition.
Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints
Hardcopy , PDF
English
31-03-2012
Important note : Users cannot be edited or removed once added to your Multi user PDF.| Committee |
EPL/501
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| DevelopmentNote |
Supersedes DD IEC PAS 62137-3 and 09/30206176 DC. (02/2012)
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| DocumentType |
Standard
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| Pages |
47
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| PublisherName |
British Standards Institution
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| Status |
Current
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| Supersedes |
IEC 62137-3:2011 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys. This first edition cancels and replaces IEC/PAS 62137-3, published in 2008, and includes some editorial revisions. The main changes with respect to the PAS include the following:
- no technical changes;
- some editorial changes and corrections;
- for the sake of convenience some constitutive changes.
| Standards | Relationship |
| IEC 62137-3:2011 | Identical |
| EN 62137-3:2012 | Identical |
| IEC 61310-3:2007 | Identical |
| EN 61310-3:2008 | Identical |
| EN 62137-1-4:2009 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 61249-2-7:2002 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
| IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
| IEC 62137-1-3:2008 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test |
| EN 62137-1-1 : 2007 | SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST |
| EN 61249-2-7:2002/corrigendum:2005 | MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
| IEC 62137-1-4:2009 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test |
| IEC 62137:2004 | Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN |
| IEC 62137-1-2:2007 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test |
| IEC 62137-1-5:2009 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| EN 62137-1-5:2009 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test |
| EN 62137-1-3:2009 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test |
| EN 62137-1-2:2007 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test |
| IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| IEC 62137-1-1:2007 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test |
| EN 60194:2006 | Printed board design, manufacture and assembly - Terms and definitions |
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