BS EN 62326-4-1:1997
Current
The latest, up-to-date edition.
Printed boards. Rigid multilayer printed boards with interlayer connections. Sectional specification Capability detail specification. Performance levels, A, B and C
Hardcopy , PDF
English
15-06-1997
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1 Scope
2 Normative references
3 Capability Qualifying Component (CQC)
4 Capability approval
5 Capability testing
6 Capability Test Board (CTB) descriptions
Figures
Annexes
A Acronyms related to IECQ and their explanations
B Conversion table
C Bibliography
ZA (normative) Normative references to international
publications with their corresponding European
publications
Defines the capability qualifying component (CQC), the characteristics to be tested, methods of testing and conditions, together with requirements for testing capability for performance level A, B or C, relating to rigid multilayer printed boards with interlayer connections.
| Committee |
EPL/501
|
| DevelopmentNote |
Also numbered as IEC 62326-4-1 and QC 230401. (09/2005)
|
| DocumentType |
Standard
|
| Pages |
68
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Standards | Relationship |
| UNE-EN 62326-4-1:1999 | Identical |
| SN EN 62326-4-1 : 1997 | Identical |
| I.S. EN 62326-4-1:1998 | Identical |
| EN 62326-4-1:1997 | Identical |
| DIN EN 62326-4-1:1997-08 | Identical |
| HD 323.2.20 : 200S3 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING |
| IEC 61249-2-11:2003 | Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 60249-3-3:1991 | Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards |
| IEC 61249-2-7:2002 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
| IEC 61188-1-1:1997 | Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies |
| IEC 62326-4:1996 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification |
| IEC 60068-2-38:2009 | Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test |
| HD 323.2.3 : 200S2 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST CA - DAMP HEAT, STEADY STATE |
| IEC 61249-4-11:2005 | Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability |
| IEC 60068-2-3:1969 | Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| IEC 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
| IEC 61249-2-9:2003 | Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad |
| EN 62326-4:1997 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification |
| EN 62326-1:2002 | Printed boards - Part 1: Generic specification |
| IEC 61249-8-7:1996 | Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks |
| HD 323.2.38 : 200S1 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TESTS Z/AD: COMPOSITE TEMPERATURE/HUMIDITY CYCLIC TEST |
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