BS EN 62326-4:1997
Current
The latest, up-to-date edition.
Printed boards Rigid multilayer printed boards with interlayer connections. Sectional specification
Hardcopy , PDF
English
15-06-1997
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1 Scope
2 Normative references
3 General
4 Capability approval and maintenance of capability
approval
5 Test specimens
6 Test sequences
7 Quality assessment
8 Customer Detail Specification (CDS) data
9 Characteristics of printed boards
10 Capability test programme
11 Quality conformance inspection
12 Test specimens
Figures
1 Resin smear at interface
2 Circumferential defects
3 Conductor pattern defects
4 Minimum annular width (W1) of external land
5 Minimum annular width (W2) of internal land
6 Hole break-out
7 Examples of soldered holes
Annexes
A Acronyms related to IECQ and their explanations
B Conversion table
C Bibliography
ZA Normative references to international publications with
their corresponding European publications
Applies to rigid multilayer printed boards whatever the method of manufacture and forms the basis for agreements between manufacturer and user.
| Committee |
EPL/501
|
| DevelopmentNote |
Also numbered as IEC 62326-4 and QC 230500. (09/2005)
|
| DocumentType |
Standard
|
| Pages |
38
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Standards | Relationship |
| EN 62326-4:1997 | Identical |
| I.S. EN 62326-4:1998 | Identical |
| SN EN 62326-4 : 1997 | Identical |
| UNE-EN 62326-4:1999 | Identical |
| DIN EN 62326-4:1997-08 | Identical |
| NBN EN 62326-4 : 1997 | Identical |
| NF EN 62326-4 : 1998 | Identical |
| HD 323.2.20 : 200S3 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING |
| EN 61249-5-1:1996 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials) |
| IEC 61249-2-11:2003 | Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 61249-2-7:2002 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
| IEC 61188-1-1:1997 | Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies |
| EN 62326-4-1:1997 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability Detail Specification - Performance levels A, B and C |
| IEC 62326-1:2002 | Printed boards - Part 1: Generic specification |
| IEC 61249-5-1:1995 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials) |
| IEC 60068-2-38:2009 | Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test |
| HD 323.2.3 : 200S2 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST CA - DAMP HEAT, STEADY STATE |
| IEC 61249-4-11:2005 | Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability |
| IEC 60068-2-3:1969 | Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| IEC 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
| IEC 61249-2-9:2003 | Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad |
| IEC 62326-4-1:1996 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C |
| EN 62326-1:2002 | Printed boards - Part 1: Generic specification |
| IEC 61249-8-7:1996 | Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks |
| HD 323.2.38 : 200S1 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TESTS Z/AD: COMPOSITE TEMPERATURE/HUMIDITY CYCLIC TEST |
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