BS QC700000(1991) : 1991

Committees responsible
National foreword
Specification
1 Scope
2 General
2.1 Order of precedence
2.2 Related documents
2.3 Units, symbols and terminology
2.4 Preferred values of voltages, currents and
         temperatures
2.5 Marking
2.5.1 Terminal identification
2.5.2 Type designation
2.5.3 Manufacturer's name or trade mark
2.5.4 Inspection lot identification code
2.6 Categories of assessed quality
2.7 Screening
2.8 Handling
3 Quality assessment procedures
3.1 Eligibility for qualification approval
3.1.1 Primary stage of manufacture
3.2 Commercially confidential information
3.3 Formation of inspection lots
3.4 Structurally similar devices
3.5 Granting of qualification approval
3.6 Quality conformance inspection
3.6.1 Division into groups and sub-groups
3.6.2 Inspection requirements
3.6.3 Supplementary procedure for reduced inspection
3.6.4 Sampling requirements for small lots
3.6.5 Certified Records of Released Lots (CRRL)
3.6.6 Delivery of devices subjected to destructive or
         non-destructive tests
3.6.7 Delayed deliveries
3.6.8 Supplementary procedure for deliveries
3.7 Statistical sampling procedures
3.7.1 AQL (Acceptable quality level) sampling plans
3.7.2 Lot tolerance per cent defective (LTPD)
         sampling plans
3.7.3 Correlation between AQL and LTPD is specified
3.8 Endurance tests where LTPD is specified
3.9 Endurance tests where the failure rate is
         specified
3.9.1 General
3.9.2 Selection of samples
3.9.3 Failures
3.9.4 Endurance test time and sample size
3.9.5 Procedure to be used if the number of observed
         failures exceeds the acceptance number
3.10 Accelerated test procedures
3.10.1 Requirements for eligibility in periodic
         testing
3.10.2 Procedure for thermally-accelerated electrical
         endurance testing
3.10.3 Damp heat (under consideration)
3.10.4 Voltage (under consideration)
3.11 Capability approval
3.11.1 General
3.11.2 Terms and definitions
3.11.3 Procedure for granting capability approval
3.11.4 Capability approval maintenance procedure
3.11.5 Procedure for reduction, extension or change of
         capability approval
3.11.6 Procedure in case of deficiency in maintenance
         of the capability approval
3.11.7 Capability manual
3.11.8 Capability test programme
3.11.9 Verification of capability approval (quality
         audit)
3.11.10 Quality assurance of products delivered under
         capability approval
3.11.11 Marking and ordering information
3.11.12 Capability abstract for publication purposes
3.11.13 Detail specifications for custom components
3.11.14 Detail specifications for catalogue products
3.11.15 Detail specification register
4 Test and measurement procedures
4.1 Standard atmospheric conditions for electrical
         and optical measurements
4.2 Definition of a destructive list
4.3 Physical examination
4.3.1 Visual examination
4.3.2 Dimensions
4.3.3 Permanence of marking
4.4 Electrical and optical measurements
4.4.1 General conditions and precautions
4.5 Environmental tests
Appendices
A Lot tolerance per cent defective (LTPD)
         sampling plans
         Table A-I LTPD sampling plans
         Table A-II Hypergeometric sampling plans for
                      small lot sizes of 200 or less
         Table A-III AQL and LTPD sampling plans
B Dimensions to be checked
C Directions for applied forces for mechanical
         tests
D Assessment of quality levels in ppm (parts
         per million)

Forms part of the IEC Quality Assessment System for Electronic Components. This publication is a generic specification for semiconductor devices: discrete devices and integrated circuits, including multichip integrated circuits, but excluding hybrid circuits. Covers order or precedence, related documents, units, symbols and terminology, preferred values of voltages, currents and temperatures, marking, terminal identification, type designation, manufacturer's name or trade mark, inspection lot identification code, categories of assessed quality, screening, handling, quality assessment procedures and test and measurement procedures.