CEI EN 60068-2-54 : 2007
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
ENVIRONMENTAL TESTING - PART 2: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD
Hardcopy , PDF
01-10-2017
English - Italian
01-01-2007
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FOREWORD
1. Scope
2. Normative references
3. Terms and definitions
4. General description of the test
5. Description of the test apparatus
6. Preconditioning
7. Materials
8. Procedure
9. Presentation of results
10. Information to be given in the relevant
specification
Annex A (normative) - Equipment specification
Annex B (informative) - Guide to the use of the
wetting balance for solderability
testing
Bibliography
Annex ZA (normative) - Normative references
to international publications with
their corresponding European
publications
Describes the outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 91-41. Supersedes CEI 50-8/1:1998. (02/2007) Superseded by CEI EN 60068-2-69 but remains current and will be withdrawn on 11-04-2020. (12/2017)
|
| DocumentType |
Standard
|
| Pages |
38
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| IEC 60068-2-54:2006 | Identical |
| EN 60068-2-54:2006 | Identical |
| HD 323.2.20 : 200S3 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| EN 61190-1-3:2007/A1:2010 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| IEC 60068-2-44:1995 | Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering |
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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