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  • CEI EN 60068-2-69 : 2008

    Current The latest, up-to-date edition.

    ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD

    Available format(s):  Hardcopy, PDF

    Language(s):  English - Italian

    Published date:  01-01-2008

    Publisher:  Comitato Elettrotecnico Italiano

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 General description of the method
    5 Description of the test apparatus
    6 Preparation of specimens
    7 Materials
    8 Procedure
    9 Presentation of results
    10 Information to be given in the relevant specification
    Annex A (normative) - Equipment specification
    Annex B (informative) - Use of the wetting balance
            for SMD solderability testing
    Annex C (normative) - Test methods for SMD components
            sizes 0603M (0201) or Smaller
    Annex D (informative) - Evaluation criteria - Guidance
    Annex E (informative) - Method of calculating the maximum
            theoretical force and integrated value of the area of
            the wetting curve for leaded non-SMD
    Bibliography
    Annex ZA (normative) - Normative references to
             international publications with their
             corresponding European publications

    Abstract - (Show below) - (Hide below)

    Describes the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations.

    General Product Information - (Show below) - (Hide below)

    Committee CT 309
    Development Note Classificazione CEI 91-49. (04/2008) 2ED 2008 Edition is valid until 11-04-2020; and only available in combined English/Italian. Supersedes CEI EN 60068-2-54 which remains current and will be withdrawn on 11-04-2020. (12/2017)
    Document Type Standard
    Publisher Comitato Elettrotecnico Italiano
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    EN 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    EN 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
    EN 60068-1:2014 Environmental testing - Part 1: General and guidance
    IEC 60068-2-66:1994 Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
    IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
    EN 60068-2-66:1994 Environmental testing - Part 2-66: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
    EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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