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  • CEI EN 60068-2-54 : 2007

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    ENVIRONMENTAL TESTING - PART 2: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD

    Available format(s):  Hardcopy, PDF

    Superseded date:  01-10-2017

    Language(s):  English - Italian

    Published date:  01-01-2007

    Publisher:  Comitato Elettrotecnico Italiano

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1. Scope
    2. Normative references
    3. Terms and definitions
    4. General description of the test
    5. Description of the test apparatus
    6. Preconditioning
    7. Materials
    8. Procedure
    9. Presentation of results
    10. Information to be given in the relevant
        specification
    Annex A (normative) - Equipment specification
    Annex B (informative) - Guide to the use of the
                            wetting balance for solderability
                            testing
    Bibliography
    Annex ZA (normative) - Normative references
                           to international publications with
                           their corresponding European
                           publications

    Abstract - (Show below) - (Hide below)

    Describes the outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability.

    General Product Information - (Show below) - (Hide below)

    Committee CT 309
    Development Note Classificazione CEI 91-41. Supersedes CEI 50-8/1:1998. (02/2007) Superseded by CEI EN 60068-2-69 but remains current and will be withdrawn on 11-04-2020. (12/2017)
    Document Type Standard
    Publisher Comitato Elettrotecnico Italiano
    Status Superseded
    Superseded By
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    HD 323.2.20 : 200S3 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING
    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    EN 60068-1:2014 Environmental testing - Part 1: General and guidance
    IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
    IEC 60068-2-44:1995 Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering
    IEC 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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