CEI EN 62137-1-3 : 2009
Current
The latest, up-to-date edition.
SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST
Hardcopy , PDF
English - Italian
01-01-2009
1 Scope
2 Normative references
3 Terms and definitions
4 General remarks
5 Test equipment and materials
6 Mounting method
7 Test method and procedure and judgment
conditions
8 Items to be included in the test report
9 Items to be given in the product specification
Annex A (normative) - Drop impact test equipment
Annex B (normative) - Test method and procedure
Annex C (informative) - Example of test equipment
and procedure
Annex D (informative) - Example of strain gauge
attachment procedure
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European publications
Pertains to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs).
Committee |
CT 309
|
DevelopmentNote |
Classificazione CEI 91-60. (12/2009)
|
DocumentType |
Standard
|
Pages |
46
|
PublisherName |
Comitato Elettrotecnico Italiano
|
Status |
Current
|
Standards | Relationship |
EN 62137-1-3:2009 | Identical |
IEC 62137-1-3:2008 | Identical |
IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
IEC 60068-2-27:2008 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
IEC 61249-2-7:2002 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
EN 61760-1:2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
IEC 60068-2-31:2008 | Environmental testing - Part 2-31: Tests - Test Ec: Rough handling shocks, primarily for equipment-type specimens |
EN 61249-2-7:2002/corrigendum:2005 | MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
IEC 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
EN 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
EN 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
EN 60194:2006 | Printed board design, manufacture and assembly - Terms and definitions |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.