CEI EN 62137-3 : 2012
Current
The latest, up-to-date edition.
ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
Hardcopy , PDF
English - Italian
01-01-2012
1 Scope
2 Normative references
3 Terms and definitions
4 General remarks
5 Procedure of selecting the applicable
test method
6 Common subjects in each test method
7 Evaluation test method
Annex A (informative) - Condition of rapid
temperature change
Annex B (informative) - Electrical continuity
test for solder joint
Annex C (informative) - Torque shear strength
test
Annex D (informative) - Monotonic bending
strength test
Annex E (informative) - Cyclic steel ball drop
strength test
Annex F (informative) - Pull strength test
Annex G (informative) - Creep strength test
Annex H (informative) - Evaluation method for
the fillet lifting phenomenon of a lead
insertion type device solder joint
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Defines the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys.
Committee |
CT 309
|
DevelopmentNote |
Classificazione CEI 91-67. (09/2012)
|
DocumentType |
Standard
|
Pages |
90
|
PublisherName |
Comitato Elettrotecnico Italiano
|
Status |
Current
|
Standards | Relationship |
IEC 62137-3:2011 | Identical |
EN 62137-3:2012 | Identical |
EN 62137-1-4:2009 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test |
IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
IEC 61249-2-7:2002 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
IEC 62137-1-3:2008 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test |
EN 62137-1-1 : 2007 | SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST |
EN 61249-2-7:2002/corrigendum:2005 | MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
IEC 62137-1-4:2009 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test |
IEC 62137:2004 | Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN |
IEC 62137-1-2:2007 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test |
IEC 62137-1-5:2009 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test |
IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
EN 62137-1-5:2009 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test |
EN 62137-1-3:2009 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test |
EN 62137-1-2:2007 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test |
IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
IEC 62137-1-1:2007 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test |
EN 60194:2006 | Printed board design, manufacture and assembly - Terms and definitions |
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