CSA E60384.1 : 2014
Current
The latest, up-to-date edition.
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
Hardcopy , PDF
English
01-01-2014
FOREWORD
1 General
2 Technical data
3 Quality assessment procedures
4 Tests and measurement procedures
Annex A (normative) - Interpretation of sampling plans and
procedures as described in IEC 60410 for use within
the IECQ system
Annex B (normative) - Rules for the preparation of detail
specifications for capacitors and resistors for
electronic equipment for use within the IECQ system
Annex C (normative) - Layout of the first page of a PCP/CQC
specification
Annex D (normative) - Requirements for capability approval
test report
Annex E (informative) - Guide for pulse testing of capacitors
Annex F (informative) - Guidance for the extension of endurance
tests on fixed capacitors
Annex G (normative) - Damp heat, steady state with voltage
applied, for metallized film capacitors only
Annex Q (normative) - Quality assessment procedures
Bibliography
Sets up standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose.
DevelopmentNote |
95 Edition is still active. (08/2017)
|
DocumentType |
Standard
|
Pages |
184
|
PublisherName |
Canadian Standards Association
|
Status |
Current
|
IEC 61193-2:2007 | Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages |
IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
IEC 60068-2-27:2008 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
IECQ 001002-3:2005 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - RULES OF PROCEDURE - PART 3: APPROVAL PROCEDURES |
IEC 61249-2-7:2002 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
IEC 60068-2-13:1983 | Basic environmental testing procedures - Part 2-13: Tests - Test M: Low air pressure |
ISO 3:1973 | Preferred numbers Series of preferred numbers |
IEC 60469-1:1987 | Pulse techniques and apparatus. Part 1: Pulse terms and definitions |
IEC 60410:1973 | Sampling plans and procedures for inspection by attributes |
IEC 60294:2012 | Measurement of the dimensions of a cylindrical component with axial terminations |
IEC 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
IEC 60068-2-17:1994 | Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing |
IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
IEC 60062:2016 | Marking codes for resistors and capacitors |
IEC 60063:2015 | Preferred number series for resistors and capacitors |
ISO 9000:2015 | Quality management systems — Fundamentals and vocabulary |
IEC 60068-2-29:1987 | Environmental testing. Part 2: Tests. Test Eb and guidance: Bump |
IEC 60717:2012 | Method for the determination of the space required by capacitors and resistors with unidirectional terminations |
IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
IEC 60469-2:1987 | Pulse techniques and apparatus. Part 2: Pulse measurement and analysis, general considerations |
IEC 60695-11-5:2016 | Fire hazard testing - Part 11-5: Test flames - Needle-flame test method - Apparatus, confirmatory test arrangement and guidance |
IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
IEC 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
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