EN 60191-6-21 : 2010
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-21: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE PACKAGES (SOP)
15-10-2010
Foreword
1 Scope
2 Normative references
3 Terms and definitions
4 Measuring methods
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Defines methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.
| Committee |
SR 47D
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| CEI EN 60191-6-21 : 2011 | Identical |
| NBN EN 60191-6-21 : 2010 | Identical |
| NF EN 60191-6-21 : 2011 | Identical |
| DIN EN 60191-6-21:2011-03 | Identical |
| PN EN 60191-6-21 : 2011 | Identical |
| UNE-EN 60191-6-21:2010 | Identical |
| NEN EN IEC 60191-6-21 : 2010 | Identical |
| BS EN 60191-6-21:2010 | Identical |
| IEC 60191-6-21:2010 | Identical |
| PNE-FprEN 60191-6-21 | Identical |
| EN IEC 60191-1:2018 | Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices |
| I.S. EN IEC 60191-1:2018 | MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES |
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
| IEC 60191-4:2013 | Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages |
| EN 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
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