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CENELEC
EN 60749-21:2011

EN 60749-21:2011

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY

Published date

19-08-2011

Publisher

European Committee for Standards - Electrical

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FOREWORD
1 Scope
2 Normative references
3 Test apparatus
4 Procedure
5 Summary
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

IEC 60749-21:2011 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment.

Committee
SR 47
DocumentType
Test Method
PublisherName
European Committee for Standards - Electrical
Status
Current

BS EN 60749-43:2017 Semiconductor devices - Mechanical and climatic test methods Guidelines for IC reliability qualification plans
CEI EN 60747-15 : 2012 SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES
EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
I.S. EN 60747-15:2012 SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES (IEC 60747-15:2010 (EQV))
EN 60749-43:2017 Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans
BS EN 60747-15:2012 Semiconductor devices. Discrete devices Isolated power semiconductor devices
CEI EN 60749-43 : 1ED 2018 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS
BS EN 62435-5:2017 Electronic components. Long-term storage of electronic semiconductor devices Die and wafer devices
I.S. EN 60749-43:2017 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS

IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
IEC 60749-15:2010 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
IEC 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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