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EN 61967-1:2002

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 1: General conditions and definitions

Superseded date

09-02-2022

Superseded by

EN IEC 61967-1:2019

Published date

05-06-2002

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1 Scope
2 Normative references
3 Definitions
4 Test conditions
  4.1 General
  4.2 Ambient conditions
      4.2.1 Ambient temperature
      4.2.2 Ambient RF field strength
      4.2.3 Other ambient conditions
      4.2.4 IC stability over time
5 Test equipment
  5.1 General
  5.2 Shielding
  5.3 RF measuring instrument
      5.3.1 Measuring receiver
      5.3.2 Spectrum analyser
      5.3.3 Other RBW for narrowband disturbances
      5.3.4 Disturbance type, detector type and sweep speed
      5.3.5 Video bandwidth
      5.3.6 Verification of calibration for the RF measuring
            instrument
  5.4 Frequency range
  5.5 Pre-amplifier or attenuator
  5.6 System gain
  5.7 Other components
6 Test set-up
  6.1 General
  6.2 Test circuit board
  6.3 IC pin loading
  6.4 Power supply requirements - Test board power supply
  6.5 IC specific considerations
      6.5.1 IC supply voltage
      6.5.2 IC decoupling
      6.5.3 Activity of IC
      6.5.4 Guidelines regarding IC operation
7 Test procedure
  7.1 Ambient check
  7.2 Operational check
  7.3 Specific procedures
8 Test report
  8.1 General
  8.2 Ambient
  8.3 Description of device
  8.4 Description of set-up
  8.5 Description of software
  8.6 Data presentation
      8.6.1 Graphical presentation
      8.6.2 Software for data capture
      8.6.3 Data processing
  8.7 RF emission limits
  8.8 Interpretation of results
      8.8.1 Comparison between IC(s) using the same test
            method
      8.8.2 Comparison between different test methods
      8.8.3 Correlation to module test methods
9 General basic test board specification
  9.1 Board description - mechanical
  9.2 Board description - electrical characteristics
  9.3 Ground planes
  9.4 Pins
      9.4.1 DIL packages
      9.4.2 SOP, PLCC, QFP packages
      9.4.3 PGA, BGA packages
  9.5 Via type
  9.6 Via distance
  9.7 Additional components
      9.7.1 Supply decoupling
      9.7.2 I/O load
Annex A (informative) Test method comparison
Annex B (informative) Flow chart of an example counter
                       test code
Annex C (informative) Prescription of a worst-case application
                       software description
Annex ZA (normative) Normative references to international
                       publications with their corresponding
                       European publications
Bibliography
Figures
Tables

Provides general information and definitions on measurement of conducted and radiated electromagnetic disturbances from integrated circuits. Also provides a description of measurement conditions, test equipment and set-up as well as the test procedures and content of the test reports. A test method comparison table is included to assist in selecting the appropriate measurement method(s). Measurement of the voltage and current of conducted RF emissions or radiated RF disturbances, coming from an integrated circuit under controlled conditions, yields information about the potential for RF disturbances in an application of the integrated circuit.

Committee
CLC/SR 47A
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Superseded
SupersededBy

Standards Relationship
UNE-EN 61967-1:2002 Identical
IEC 61967-1:2002 Identical
DIN EN 61967-1:2003-01 Identical
NBN EN 61967-1 : 2003 Identical
PN-EN 61967-1:2003 Identical
BS EN 61967-1:2002 Identical
I.S. EN 61967-1:2002 Identical
NEN EN IEC 61967-1 : 2002 Identical
CEI EN 61967-1 : 2002 Identical
NF EN 61967-1 : 2002 Identical

I.S. EN 61967-4:2002 INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 4: MEASUREMENT OF CONDUCTED EMISSIONS - 1 OHM/150 OHM DIRECT COUPLING METHOD
BS EN 62228-2:2017 Integrated circuits. EMC evaluation of transceivers LIN transceivers
EN 61967-2:2005 Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method
EN 62433-3:2017 EMC IC modelling - Part 3: Models of Integrated Circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE)
BS EN 61967-8:2011 Integrated circuits. Measurement of electromagnetic emissions Measurement of radiated emissions. IC stripline method
BS EN 61967-4 : 2002 INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 4: MEASUREMENT OF CONDUCTED EMISSIONS - 1 OHM/150 OHM DIRECT COUPLING METHOD
CEI EN 62228-2 : 1ED 2017 INTEGRATED CIRCUITS - EMC EVALUATION OF TRANSCEIVERS - PART 2: LIN TRANSCEIVERS
CEI EN 62433-3 : 1ED 2017 EMC IC MODELLING - PART 3: MODELS OF INTEGRATED CIRCUITS FOR EMI BEHAVIOURAL SIMULATION - RADIATED EMISSIONS MODELLING (ICEMRE)
BS EN 61967-6 : 2002 INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 6: MEASUREMENT OF CONDUCTED EMISSIONS - MAGNETIC PROBE METHOD
I.S. EN 61967-8:2011 INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS - PART 8: MEASUREMENT OF RADIATED EMISSIONS - IC STRIPLINE METHOD (IEC 61967-8:2011 (EQV))
I.S. EN 62228-2:2017 INTEGRATED CIRCUITS - EMC EVALUATION OF TRANSCEIVERS - PART 2: LIN TRANSCEIVERS
CEI EN 61967-4 : 2009 INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 4: MEASUREMENT OF CONDUCTED EMISSIONS - 1 OHM/150 OHM DIRECT COUPLING METHOD
CEI EN 61967-8 : 2012 INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS - PART 8: MEASUREMENT OF RADIATED EMISSIONS - IC STRIPLINE METHOD
BS EN 61967-2:2005 Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz Measurement of radiated emissions. TEM cell and wideband TEM cell method
BS EN 62132-1:2016 Integrated circuits. Measurement of electromagnetic immunity General conditions and definitions
I.S. EN 61967-5:2003 INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 5: MEASUREMENT OF CONDUCTED EMISSIONS - WORKBENCH FARADAY CAGE METHOD
I.S. EN 62433-3:2017 EMC IC MODELLING - PART 3: MODELS OF INTEGRATED CIRCUITS FOR EMI BEHAVIOURAL SIMULATION - RADIATED EMISSIONS MODELLING (ICEM-RE)
BS EN 62433-3:2017 EMC IC modelling Models of integrated Circuits for EMI behavioural simulation. Radiated emissions modelling (ICEM-RE)
EN 61967-6:2002/A1:2008 INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 6: MEASUREMENT OF CONDUCTED EMISSIONS - MAGNETIC PROBE METHOD
EN 61967-8 : 2011 INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS - PART 8: MEASUREMENT OF RADIATED EMISSIONS - IC STRIPLINE METHOD
I.S. EN 61967-6:2003 INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 6: MEASUREMENT OF CONDUCTED EMISSIONS - MAGNETIC PROBE METHOD
I.S. EN 61967-2:2005 INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 2: MEASUREMENT OF RADIATED EMISSIONS - TEM CELL AND WIDEBAND TEM CELL METHOD
EN 61967-4 : 2002 COR 2017 INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 4: MEASUREMENT OF CONDUCTED EMISSIONS - 1 OHM/150 OHM DIRECT COUPLING METHOD (IEC 61967-4:2002/COR1:2017)
EN 62132-1:2016 Integrated circuits - Measurement of electromagnetic immunity - Part 1: General conditions and definitions
EN 62228-2:2017 Integrated circuits - EMC evaluation of transceivers - Part 2: LIN transceivers

CISPR 25:2016 Vehicles, boats and internal combustion engines - Radio disturbance characteristics - Limits and methods of measurement for the protection of on-board receivers
IEEE C63.2-2009 American National Standard for Electromagnetic Noise and Field Strength Instrumentation, 10 Hz to 40 GHz Specifications
CISPR 16-1:1999+AMD1:2002 CSV Specification for radio disturbance and immunity measuring apparatus and methods - Part 1: Radio disturbance and immunity measuring apparatus

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