EN 62258-6 : 2006

INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General
5 Requirements for information for thermal simulation
  5.1 Requirements for bare die with or without added
      connection structures
  5.2 Requirements for minimally-packaged die
  5.3 Information on thermal simulation model
Annex ZA (normative) Normative references to
         international publications with their
         corresponding European publications
Bibliography

Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die.