EN 62326-4-1:1997
Current
The latest, up-to-date edition.
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability Detail Specification - Performance levels A, B and C
15-01-1997
1 Scope
2 Normative references
3 Capability Qualifying Component (CQC)
4 Capability approval
5 Capability testing
6 Capability Test Board (CTB) descriptions
Figures
Annexes
A Acronyms related to IECQ and their explanations
B Conversion table
C Bibliography
ZA (normative) Normative references to international
publications with their corresponding European
publications
Relates to rigid multilayer printed boards with interlayer connections. Specifies the capability qualifying component, the characteristics to be tested, the test methods and conditions to be applied, and the requirements to be fulfilled for testing capability for performance level A, B or C.
| Committee |
CLC/SR 91
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| BS EN 62326-4-1:1997 | Identical |
| I.S. EN 62326-4-1:1998 | Identical |
| PN EN 62326-4-1 : 2002 | Identical |
| NBN EN 62326 4-1 : 1997 | Identical |
| DIN EN 62326-4-1:1997-08 | Identical |
| UNE-EN 62326-4-1:1999 | Identical |
| IEC 62326-4-1:1996 | Identical |
| SN EN 62326-4-1 : 1997 | Identical |
| NF EN 62326 4-1 : 1998 | Identical |
| BS EN 61241-18:2004 | Electrical apparatus for use in the presence of combustible dust Protection by encapsulation \'mD\' |
| BS EN 60079-18 : 2015 | EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M' |
| EN 62326-1:2002 | Printed boards - Part 1: Generic specification |
| BS EN 62326-1:2002 | Printed boards Generic specification |
| NF EN 61249 8-8 : 1998 | MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 8: TEMPORARY POLYMER COATINGS |
| BS EN 62326-4:1997 | Printed boards Rigid multilayer printed boards with interlayer connections. Sectional specification |
| CEI EN 60079-18 : 2016 | EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M' |
| CEI EN 62326-1 : 2002 | PRINTED BOARDS - PART 1: GENERIC SPECIFICATION |
| I.S. EN 61189-3:2008 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) |
| BS EN 61249-8-8:1997 | Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Temporary polymer coatings |
| EN 61241-18:2004 | Electrical apparatus for use in the presence of combustible dust - Part 18: Protection by encapsulation "mD" |
| BS EN 61189-3:2008 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards) |
| EN 60079-18:2015/A1:2017 | EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M' (IEC 60079-18:2014/A1:2017) |
| I.S. EN 60079-18:2015 | EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M' |
| I.S. EN 62326-1:2002 | PRINTED BOARDS - GENERIC SPECIFICATION |
| EN 61189-3:2008 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 60249-3-3:1991 | Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards |
| IEC 60068-2-38:2009 | Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test |
| IEC 60068-2-3:1969 | Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state |
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