GEIA HB 0005-2 : 2007
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
Hardcopy , PDF
01-03-2022
English
01-01-2007
Important note : Users cannot be edited or removed once added to your Multi user PDF.
1. Scope
2. References
3. Terms and definitions
4. Approach
5. General Pb-Free Solder Alloy Behavior
6. System Level Service Environment
7. High Performance Electronics Testing
8. Solder Joint Reliability Considerations
9. Piece-parts
10. Printed Circuit Boards
11. Printed Circuit Board Assembly
12. Module Assembly Considerations
13. Manufacturing Resources
14. Aerospace Wiring/Cabling Considerations
15. Rework/Repair
16. Generic Life Testing
17. Similarity Analysis
Appendix A: Equipment Service Environmental Definition
A1. Steady Temperature Service Environments
A2. Service Cyclic Temperature Environments
Describes technical guidance by Aerospace system suppliers, e.g., Aerospace system Original Equipment Manufacturers (OEMs) and Aerospace system maintenance facilities, in developing and implementing designs and processes to assure the continued performance, quality, reliability, safety, airworthiness, configuration control, affordability, maintainability, and supportability of high performance aerospace systems (subsequently referred to as AHP) both during and after the transition to Pb-Free electronics.
| Committee |
G-24
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| DocumentType |
Standard
|
| Pages |
0
|
| PublisherName |
Government Electronics & Information Technology Association
|
| Status |
Superseded
|
| SupersededBy |
| IEC PAS 62647-3:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes |
| IEC TS 62647-21:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics |
| SAE ARP5890A | Guidelines for Preparing Reliability Assessment Plans for Electronic Engine Controls |
| PD IEC/TS 62647-1:2012 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan |
| IEC PAS 62647-23:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
| GEIA HB 0005-1 : 2006 | PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS |
| IEC TS 62647-3:2014 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes |
| IEC TS 62239-1:2015 | Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan |
| GEIA HB 0005-3 : 2008 | REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
| GEIA STD 0005-1 : 2012 | PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
| GEIA STD 0005-3 : 2013 | PERFORMANCE TESTING FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC INTERCONNECTS CONTAINING PB-FREE SOLDER AND FINISHES |
| NASA JSC 66491 : 2013 | STANDARD FOR JSC LEAD-FREE CONTROL PLANS (LFCP) |
| IEC TS 62647-1:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan |
| PD IEC/TS 62647-21:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Program management. Systems engineering guidelines for managing the transition to lead-free electronics |
| ARINC 671 : 2006 | GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR |
| IEC PAS 62647-21:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics |
| 17/30365636 DC : 0 | BS EN 62239-1 ED.1.0 - PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
| PD IEC/TS 62239-1:2015 | Process management for avionics. Management plan Preparation and maintenance of an electronic components management plan |
| IEC PAS 62647-1:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management |
| PD IEC/PAS 62647-1:2011 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management |
| DD IEC PAS 62647-23 : DRAFT AUG 2011 | PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES |
| PD IEC/TS 62647-3:2014 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Performance testing for systems containing lead-free solder and finishes |
| DD IEC PAS 62647-3 : DRAFT SEP 2011 | PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 3: PERFORMANCE TESTING FOR SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
| IPC J STD 609 : A | MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
| IPC 4552 : 0 | PERFORMANCE SPECIFICATION FOR ELECTROLESS NICKEL/IMMERSION GOLD (ENIG) PLATING FOR PRINTED BOARDS |
| IPC 4553 : A | SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS |
| GEIA STD 0005-3 : 2013 | PERFORMANCE TESTING FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC INTERCONNECTS CONTAINING PB-FREE SOLDER AND FINISHES |
| IPC J STD 001 : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC JP002 : 0 | JEDEC/IPC CURRENT TIN WHISKERS THEORY AND MITIGATION PRACTICES GUIDELINE |
| IPC CC 830 : B | QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES |
| MIL-I-46058 Revision C:1972 | Insulating Compound, Electrical (for Coating Printed Circuit Assemblies) |
| ASTM G 85 : 2011 : REDLINE | Standard Practice for Modified Salt Spray (Fog) Testing |
| IPC J STD 006 : C | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
| GEIA HB 0005-3 : 2008 | REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
| IPC A 610 : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| GEIA STD 0005-2 : 2012 | MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
| IPC J STD 002 : D | SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES |
| GEIA HB 0005-1 : 2006 | PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 1066 : 0 | MARKING, SYMBOLS AND LABELS FOR IDENTIFICATION OF LEAD-FREE AND OTHER REPORTABLE MATERIALS IN LEAD-FREE ASSEMBLIES, COMPONENTS AND DEVICES |
| GEIA STD 0005-1 : 2012 | PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
| IPC 9701 : A | PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS |
| GEIA STD 0006 : 2008 | REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS |
| IPC 4554 : 0 | SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS |
| ARINC 671 : 2006 | GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR |
| IPC 7095 : C | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
| IPC 1752 : A-2 | MATERIALS DECLARATION MANAGEMENT |
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