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  • GEIA STD 0005-3 : 2013

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    PERFORMANCE TESTING FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC INTERCONNECTS CONTAINING PB-FREE SOLDER AND FINISHES

    Available format(s):  Hardcopy, PDF

    Superseded date:  24-02-2018

    Language(s):  English

    Published date:  31-12-2012

    Publisher:  Government Electronics & Information Technology Association

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    Table of Contents - (Show below) - (Hide below)

    ACKNOWLEDGEMENTS
    FORWARD
    INTRODUCTION
    1.0 SCOPE
    2.0 REFERENCES
    3.0 TERMS AND DEFINITIONS
    4.0 DEFAULT TEST METHODS
    5.0 PROTOCOL TO DESIGN AND CONDUCT PERFORMANCE TESTS
    6.0 TESTING OF COMMERCIAL-OFF-THE-SHELF (COTS) PRODUCTS
        WITH PB-FREE
    7.0 FINAL REMARKS
    APPENDIX A - TEST SAMPLE SIZE
    APPENDIX B - BULK MATERIALS TESTING
    APPENDIX C - NASA-DOD PB-FREE ELECTRONICS PROJECT
    APPENDIX D - ILLUSTRATIVE EXAMPLES OF FAILURE MECHANISMS
                 IN THERMALLY AGED PB-FREE INTERCONNECTS

    Abstract - (Show below) - (Hide below)

    Describes a default method for those companies that require a pre-defined approach and a protocol for those companies that wish to develop their own test methods.

    General Product Information - (Show below) - (Hide below)

    Committee G-24
    Document Type Standard
    Publisher Government Electronics & Information Technology Association
    Status Superseded
    Superseded By
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    PD IEC/TS 62647-1:2012 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan
    GEIA HB 0005-1 : 2006 PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS
    IEC TS 62239-1:2015 Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan
    GEIA HB 0005-3 : 2008 REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
    GEIA HB 0005-2 : 2007 TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
    GEIA STD 0005-1 : 2012 PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
    IEC TS 62647-1:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
    17/30365636 DC : 0 BS EN 62239-1 ED.1.0 - PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
    PD IEC/TS 62239-1:2015 Process management for avionics. Management plan Preparation and maintenance of an electronic components management plan

    Standards Referencing This Book - (Show below) - (Hide below)

    GEIA HB 0005-2 : 2007 TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
    MIL-STD-810 Revision G:2008 ENVIRONMENTAL ENGINEERING CONSIDERATIONS AND LABORATORY TESTS
    IPC 9703 : 0 IPC/JEDEC MECHANICAL SHOCK TEST GUIDELINES FOR SOLDER JOINT RELIABILITY
    GEIA STD 0005-2 : 2012 MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
    GEIA HB 0005-1 : 2006 PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS
    MIL-HDBK-217 Revision F:1991 RELIABILITY PREDICTION OF ELECTRONIC EQUIPMENT
    GEIA STD 0005-1 : 2012 PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
    IPC 9701 : A PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
    IPC SM 785 : 0 GUIDELINES FOR ACCELERATED RELIABILITY TESTING OF SURFACE MOUNT ATTACHMENTS
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