I.S. EN 60191-6:2009
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES
Hardcopy , PDF
English
01-01-2009
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Design rules
5 Dimensions to be specified
6 Notes
Annex A (informative) - Illustration of the rules
Annex B (informative) - Optional table format
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Provides rules for the preparation of outlines drawings of surface-mounted semiconductor devices.
DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
DocumentType |
Standard
|
Pages |
43
|
PublisherName |
National Standards Authority of Ireland
|
Status |
Current
|
Standards | Relationship |
NBN EN 60191-6 : 2010 | Identical |
IEC 60191-6:2009 | Identical |
NF EN 60191-6 : 2011 | Identical |
BS EN 60191-6:2009 | Identical |
DIN EN 60191-6:2010-06 | Identical |
EN 60191-6:2009 | Identical |
IEC 60191-1:2007 | Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices |
ISO 2692:2014 | Geometrical product specifications (GPS) Geometrical tolerancing Maximum material requirement (MMR), least material requirement (LMR) and reciprocity requirement (RPR) |
EN ISO 1101:2017 | Geometrical product specifications (GPS) - Geometrical tolerancing - Tolerances of form, orientation, location and run-out (ISO 1101:2017) |
ISO 1101:2017 | Geometrical product specifications (GPS) — Geometrical tolerancing — Tolerances of form, orientation, location and run-out |
IEC 60191-2:2012 DB | Mechanical standardization of semiconductor devices - Part 2: Dimensions |
IEC 60191-4:2013 | Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages |
IEC 60191-3:1999 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits |
EN 60191-1:2007 | Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.