I.S. EN 60191-6-5:2002
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-5: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR FINE-PITCH BALL GRID ARRAY (FBGA)
Hardcopy , PDF
English
01-01-2002
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FOREWORD
1 Scope
2 Normative references
3 Definitions
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Gives common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array (hereinafter called FBGA), whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
18
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 60191-6-5 : 2002 | Identical |
| IEC 60191-6-5:2001 | Identical |
| UNE-EN 60191-6-5:2002 | Identical |
| BS EN 60191-6-5:2001 | Identical |
| EN 60191-6-5:2001 | Identical |
| DIN EN 60191-6-5:2002-05 | Identical |
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
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