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I.S. EN 60749-34:2010

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 34: POWER CYCLING

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2010

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.


Dates of withdrawal of national standards are available from NSAI.

€28.00
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FOREWORD
1 Scope and object
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Procedure
6 Test conditions
7 Precautions
8 Measurements
9 Failure criteria
10 Summary
Bibliography
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Provides a test method used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors.

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
16
PublisherName
National Standards Authority of Ireland
Status
Current

Standards Relationship
BS EN 60749-34:2010 Identical
UNE-EN 60749-34:2011 Identical
NF EN 60749-34 : 2011 Identical
DIN EN 60749-34:2011-05 Identical
NBN EN 60749-34 : 2011 Identical
EN 60749-34:2010 Identical
IEC 60749-34:2010 Identical

EN 60749-23:2004/A1:2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 23: HIGH TEMPERATURE OPERATING LIFE
IEC 60747-1:2006+AMD1:2010 CSV Semiconductor devices - Part 1: General
IEC 60749-3:2017 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
EN 60749-3:2017 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
IEC 60747-6:2016 Semiconductor devices - Part 6: Discrete devices - Thyristors
IEC 60747-2:2016 Semiconductor devices - Part 2: Discrete devices - Rectifier diodes
IEC 60749-23:2004+AMD1:2011 CSV Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

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