I.S. EN 61190-1-3:2007
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
Hardcopy , PDF
17-01-2021
English
01-01-2007
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Classification
4.1 Alloy composition
4.2 Solder form
4.3 Flux type
4.4 Flux percentage and metal content
4.5 Other characteristics
5 Requirements
5.1 Materials
5.2 Alloys
5.3 Solder forms
5.4 Flux type and form
5.5 Flux residue dryness
5.6 Spitting
5.7 Solder pool
5.8 Labelling for product identification
5.9 Workmanship
6 Quality assurance provisions
6.1 Responsibility for inspection and compliance
6.2 Classification of inspections
6.3 Materials inspection
6.4 Qualification inspections
6.5 Quality conformance
6.6 Preparation of solder alloy for test
7 Preparation for delivery - Preservation, packing and
packaging
Annex A (informative) Selection of various alloys and
fluxes for use in electronic soldering - General
information concerning IEC 61190-1-3
Annex B (normative) Lead-free solder alloys tests
Annex C (informative) Marking method of solder designation
for mounted board, used in electronic equipment
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering applications and for 'special' electronic grade solders.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
53
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Withdrawn
|
| Standards | Relationship |
| NF EN 61190-1-3 : 2008 AMD 1 2010 | Identical |
| DIN EN 61190-1-3:2015-05 (Draft) | Identical |
| EN 61190-1-3:2007/A1:2010 | Identical |
| EN 61190-1-3:2007 | Identical |
| BS EN 61190-1-3 : 2007 | Identical |
| EN 61189-5 : 2006 | TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| EN 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| ISO 9454-2:1998 | Soft soldering fluxes Classification and requirements Part 2: Performance requirements |
| EN ISO 9454-2:2000 | Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements (ISO 9454-2:1998) |
| ISO 9454-1:2016 | Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging |
| IEC 61189-6:2006 | Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies |
| IEC 61189-5:2006 | Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies |
| EN ISO 9001:2015 | Quality management systems - Requirements (ISO 9001:2015) |
| EN ISO 9453:2014 | Soft solder alloys - Chemical compositions and forms (ISO 9453:2014) |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| EN 29454-1:1993 | Soft soldering fluxes - Classification and requirements - Part 1: Classification, labelling and packaging (ISO 9454-1:1990) |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| EN 61189-6:2006 | Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies |
| ISO 9001:2015 | Quality management systems — Requirements |
| ISO 9453:2014 | Soft solder alloys Chemical compositions and forms |
| EN 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| EN 60194:2006 | Printed board design, manufacture and assembly - Terms and definitions |
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