I.S. EN 62137-1-3:2009
Current
The latest, up-to-date edition.
SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST
Hardcopy , PDF
English
01-01-2009
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General remarks
5 Test equipment and materials
5.1 Reflow soldering oven
5.2 Drop impact test equipment
5.3 Test substrate
5.4 Solder alloy
5.5 Solder paste
5.6 Specimen components
5.7 Strain gauge
6 Mounting method
7 Test method and procedure, and judgment conditions
7.1 Test procedure
7.2 Judgment conditions
8 Items to be included in the test report
9 Items to be given in the product specification
Annex A (normative) - Drop impact test equipment
Annex B (normative) - Test method and procedure
Annex C (informative) - An example of test equipment
and procedure
Annex D (informative) - An example of strain gauge
attachment procedure
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Pertains to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs).
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
56
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| EN 62137-1-3:2009 | Identical |
| IEC 62137-1-3:2008 | Identical |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-27:2008 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| IEC 61249-2-7:2002 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
| EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
| EN 61760-1:2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
| IEC 60068-2-31:2008 | Environmental testing - Part 2-31: Tests - Test Ec: Rough handling shocks, primarily for equipment-type specimens |
| EN 61249-2-7:2002/corrigendum:2005 | MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
| EN 60068-2-27:2009 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
| IEC 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| EN 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| EN 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
| EN 60194:2006 | Printed board design, manufacture and assembly - Terms and definitions |
| EN 60068-2-31:2008 | ENVIRONMENTAL TESTING - PART 2-31: TESTS - TEST EC: ROUGH HANDLING SHOCKS, PRIMARILY FOR EQUIPMENT-TYPE SPECIMENS |
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