IEC 60747-12-2:1995
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Semiconductor devices - Part 12: Optoelectronic devices - Section 2: Blank detail specification for laser diode modules with pigtail for fibre optic systems and sub-systems
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
15-02-2005
English - French
18-07-1995
Important note : Users cannot be edited or removed once added to your Multi user PDF.
FOREWORD
INTRODUCTION
1 Mechanical description
2 Short description
3 Categories of assessed quality
4 Limiting values (absolute maximum rating system)
common to all applications
5 Electrical characteristics
6 Marking
7 Ordering information
8 Test conditions and inspection requirements
9 Group D - Qualification approval tests
10 Additional information (not for inspection purposes)
Specifies quality assessment methods in a way that electronic components released by one participating country as complying with the requirements of an applicable specification are equally accepted in all other participating countries without further testing being necessary.
| DevelopmentNote |
Also numbered as BS QC720102(1997) (08/2005)
|
| DocumentType |
Standard
|
| Pages |
31
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Withdrawn
|
| BS EN 61751:1998 | Laser modules used for telecommunication. Reliability assessment |
| BS EN 61709:2017 | Electric components. Reliability. Reference conditions for failure rates and stress models for conversion |
| I.S. EN 61751:1999 | LASER MODULES USED FOR TELECOMMUNICATION - RELIABILITY ASSESSMENT |
| UTEC 80 810 : 2005 | RELIABILITY DATA HANDBOOK - UNIVERSAL MODEL FOR RELIABILITY PREDICTION OF ELECTRONICS COMPONENTS, PCBS AND EQUIPMENT |
| IEC 61709:2017 RLV | Electric components - Reliability - Reference conditions for failure rates and stress models for conversion |
| EN 61709:2017 | Electric components - Reliability - Reference conditions for failure rates and stress models for conversion |
| PD IEC TR 62380:2004 | Reliability data handbook. Universal model for reliability prediction of electronics components, PCBs and equipment |
| I.S. EN 61709:2017 | ELECTRIC COMPONENTS - RELIABILITY - REFERENCE CONDITIONS FOR FAILURE RATES AND STRESS MODELS FOR CONVERSION |
| IEC 61751:1998 | Laser modules used for telecommunication - Reliability assessment |
| IEC 61747-1:1998+AMD1:2003 CSV | Liquid crystal and solid-state display devices - Part 1: Generic specification |
| EN 61751:1998 | Laser modules used for telecommunication - Reliability assessment |
| IEC TR 62380:2004 | Reliability data handbook - Universal model for reliability prediction of electronics components, PCBs and equipment |
| IEC 61709:2017 | Electric components - Reliability - Reference conditions for failure rates and stress models for conversion |
| IEC 60747-12:1991 | Semiconductor devices - Part 12: Sectional specification foroptoelectronic devices |
| IEC 60747-10:1991 | Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits |
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