• IEC 61709:2017 RLV

    Current The latest, up-to-date edition.

    Electric components - Reliability - Reference conditions for failure rates and stress models for conversion

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English

    Published date:  17-02-2017

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms, definitions and symbols
    4 Context and conditions
    5 Generic reference conditions and stress models
    6 Integrated semiconductor circuits
    7 Discrete semiconductors
    8 Optoelectronic components
    9 Capacitors
    10 Resistors and resistor networks
    11 Inductors, transformers and coils
    12 Microwave devices
    13 Other passive components
    14 Electrical connections
    15 Connectors and sockets
    16 Relays
    17 Switches and push-buttons
    18 Signal and pilot lamps
    19 Printed circuit boards (PCB)
    20 Hybrid circuits
    Annex A (normative) - Failure modes of components
    Annex B (informative) - Thermal model for
            semiconductors
    Annex C (informative) - Failure rate prediction
    Annex D (informative) - Considerations on mission
            profile
    Annex E (informative) - Useful life models
    Annex F (informative) - Physics of failure
    Annex G (informative) - Considerations for the design
            of a data base on failure rates
    Annex H (informative) - Potential sources of failure
            rate data and methods of selection
    Annex I (informative) - Overview of component
            classification
    Annex J (informative) - Presentation of component
            reliability data
    Annex K (informative) - Examples
    Bibliography

    Abstract - (Show below) - (Hide below)

    IEC 61709:2017 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.

    IEC 61709:2017 gives guidance on the use of failure rate data for reliability prediction of electric components used in equipment. The method presented in this document uses the concept of reference conditions which are the typical values of stresses that are observed by components in the majority of applications. Reference conditions are useful since they provide a known standard basis from which failure rates can be modified to account for differences in environment from the environments taken as reference conditions. Each user can use the reference conditions defined in this document or use their own. When failure rates stated at reference conditions are used it allows realistic reliability predictions to be made in the early design phase. The stress models described herein are generic and can be used as a basis for conversion of failure rate data given at these reference conditions to actual operating conditions when needed and this simplifies the prediction approach. Conversion of failure rate data is only possible within the specified functional limits of the components. This document also gives guidance on how a database of component failure data can be constructed to provide failure rates that can be used with the included stress models. Reference conditions for failure rate data are specified, so that data from different sources can be compared on a uniform basis. If failure rate data are given in accordance with this document then additional information on the specified conditions can be dispensed with. This document does not provide base failure rates for components – rather it provides models that allow failure rates obtained by other means to be converted from one operating condition to another operating condition. The prediction methodology described in this document assumes that the parts are being used within its useful life. The methods in this document have a general application but are specifically applied to a selection of component types as defined in Clauses 6 to 20 and I.2. This third edition cancels and replaces the second edition, published in 2011. This edition constitutes a technical revision. This third edition is a merger of IEC 61709:2011 and IEC TR 62380:2004.
    This edition includes the following significant technical changes with respect to the previous edition: addition of 4.5 Components choice, 4.6 Reliability growth during the deployment phase of new equipment, 4.7 How to use this document, and of Clause 19 Printed circuit boards (PCB) and Clause 20 Hybrid circuits with respect to IEC TR 62380; addition of failure modes of components in Annex A; modification of Annex B, Thermal model for semiconductors, adopted and revised from IEC TR 62380; modification of Annex D, Considerations on mission profile; modification of Annex E, Useful life models, adopted and revised from IEC TR 62380; revision of Annex F (former B.2.6.4), Physics of failure; addition of Annex G (former Annex C), Considerations for the design of a data base on failure rates, complemented with parts of IEC 60319; addition of Annex H, Potential sources of failure rate data and methods of selection; addition of Annex J, Presentation of component reliability data, based on IEC 60319.
    The contents of the corrigendum of October 2019 have been included in this copy.
    Keywords: failure rate data, reliability prediction of electric components

    General Product Information - (Show below) - (Hide below)

    Committee TC 56
    Development Note Also available in CD-ROM format. Stability Date: 2020. (02/2017)
    Document Type Redline
    Publisher International Electrotechnical Committee
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 62308:2006 Equipment reliability - Reliability assessment methods
    IEC 61812-1:2011 Time relays for industrial and residential use - Part 1: Requirements and tests
    EN 300 019-1-5 : 2.1.4 ENVIRONMENTAL ENGINEERING (EE); ENVIRONMENTAL CONDITIONS AND ENVIRONMENTAL TESTS FOR TELECOMMUNICATIONS EQUIPMENT; PART 1-5: CLASSIFICATION OF ENVIRONMENTAL CONDITIONS; GROUND VEHICLE INSTALLATIONS
    IEC 60319:1999 Presentation and specification of reliability data for electronic components
    IEC PAS 62435:2005 Electronic components - Long-duration storage of electronic components - Guidance for implementation
    IEC 60300-3-3:2017 Dependability management - Part 3-3: Application guide - Life cycle costing
    IEC 61649:2008 Weibull analysis
    IEC 62741:2015 Demonstration of dependability requirements - The dependability case
    IEC 61014:2003 Programmes for reliability growth
    IEC 60050-151:2001 International Electrotechnical Vocabulary (IEV) - Part 151: Electrical and magnetic devices
    IEC 61360-4:2005 Standard data element types with associated classification scheme for electric components - Part 4: IEC reference collection of standard data element types and component classes
    IEC 60605-6:2007 Equipment reliability testing - Part 6: Tests for the validity and estimation of the constant failure rate and constant failure intensity
    ETS 300 200019-1-4 : 20001 EQUIPMENT ENGINEERING (EE); ENVIRONMENTAL CONDITIONS AND ENVIRONMENTAL TESTS FOR TELECOMMUNICATIONS EQUIPMENT - CLASSIFICATION OF ENVIRONMENTAL CONDITIONS - STATIONARY USE AT NON-WEATHERPROTECTED LOCATIONS
    VITA 51.2 : 2016 PHYSICS OF FAILURE RELIABILITY PREDICTIONS
    IEC 60721-3-7:1995+AMD1:1996 CSV Classification of environmental conditions - Part 3-7: Classification of groups of environmental parameters and their severities - Portable and non-stationary use
    IEC 60721-3-5:1997 Classification of environmental conditions - Part 3: Classificationof groups of environmental parameters and their severities -Section 5: Ground vehicle installations
    EN 300 019-1-7 : 2.1.4 ENVIRONMENTAL ENGINEERING (EE); ENVIRONMENTAL CONDITIONS AND ENVIRONMENTAL TESTS FOR TELECOMMUNICATIONS EQUIPMENT; PART 1-7: CLASSIFICATION OF ENVIRONMENTAL CONDITIONS; PORTABLE AND NON-STATIONARY USE
    ISO 10303-31:1994 Industrial automation systems and integration Product data representation and exchange Part 31: Conformance testing methodology and framework: General concepts
    IEC TR 62380:2004 Reliability data handbook - Universal model for reliability prediction of electronics components, PCBs and equipment
    IEC 61360-1:2017 Standard data element types with associated classification scheme - Part 1: Definitions - Principles and methods
    IEC 60650:1979 Analogue counting ratemeters. Characteristics and test methods
    ISO 10303-11:2004 Industrial automation systems and integration Product data representation and exchange Part 11: Description methods: The EXPRESS language reference manual
    IEC 61810-2:2017 Electromechanical elementary relays - Part 2: Reliability
    IEC 61163-2:1998 Reliability stress screening - Part 2: Electronic components
    DEFSTAN 00-42(PT3)/4(2011) : 2011 RELIABILITY AND MAINTAINABILITY ASSURANCE GUIDE - PART 3: R&M CASE
    IEC 60300-3-2:2004 Dependability management - Part 3-2: Application guide - Collection of dependability data from the field
    IEC 61810-2-1:2017 Electromechanical elementary relays - Part 2-1: Reliability - Procedure for the verification of B10 values
    IEC 60747-12-2:1995 Semiconductor devices - Part 12: Optoelectronic devices - Section 2: Blank detail specification for laser diode modules with pigtail for fibre optic systems and sub-systems
    IEC 61703:2016 Mathematical expressions for reliability, availability, maintainability and maintenance support terms
    IEC TR 60943:1998+AMD1:2008 CSV Guidance concerning the permissible temperature rise for parts of electrical equipment, in particular for terminals
    IEC 60747-1:2006+AMD1:2010 CSV Semiconductor devices - Part 1: General
    MIL C 18312 : G CAPACITOR, FIXED, METALLIZED (PAPER-PLASTIC, OR PLASTIC FILM) DIELECTRIC, DIRECT CURRENT (HERMETICALLY SEALED IN METAL CASES), GENERAL SPECIFICATION FOR
    IEC 60721-3-3:1994+AMD1:1995+AMD2:1996 CSV Classification of environmental conditions - Part 3-3: Classification of groups of environmental parameters and their severities - Stationary use at weatherprotected locations
    EN 300 019-1-8 : 2.1.4 ENVIRONMENTAL ENGINEERING (EE); ENVIRONMENTAL CONDITIONS AND ENVIRONMENTAL TESTS FOR TELECOMMUNICATIONS EQUIPMENT; PART 1-8: CLASSIFICATION OF ENVIRONMENTAL CONDITIONS; STATIONARY USE AT UNDERGROUND LOCATIONS
    IEC 60050-521:2002 International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits
    IEC 61710:2013 Power law model - Goodness-of-fit tests and estimation methods
    ETS 300 200019-1-3 : 20001 EQUIPMENT ENGINEERING (EE); ENVIRONMENTAL CONDITIONS AND ENVIRONMENTAL TESTS FOR TELECOMMUNICATIONS EQUIPMENT - CLASSIFICATION OF ENVIRONMENTAL CONDITIONS - STATIONARY USE AT WEATHERPROTECTED LOCATIONS
    IEC 60300-3-5:2001 Dependability management - Part 3-5: Application guide - Reliability test conditions and statistical test principles
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