IEC 62025-2:2005
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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High frequency inductive components - Non-electrical characteristics and measuring methods - Part 2: Test methods for non-electrical characteristics
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
12-09-2022
English - French
28-01-2005
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test conditions
4.1 Standard atmospheric conditions for test
4.2 Referee conditions
5 Mechanical characteristics test
5.1 Body strength test
5.2 Robustness of termination (electrode)
5.3 Solderability
5.4 Resistance to soldering heat
5.5 Resistance to dissolution of metallization
5.6 Vibration
5.7 Resistance to shock
Annex A (normative) Mounting of surface mounting inductor
to test printed-circuit board
Specifies a test method for the non-electrical characteristics of the surface mounted device inductors to be used for electronic and telecommunication equipment. Defines methods for measuring mechanical performance only. To be used in conjunction with IEC 62211.
| Committee |
TC 51
|
| DevelopmentNote |
Stability Date: 2018. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
47
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| JIS C 62025-2:2009 | Identical |
| NF EN 62025-2 : 2005 | Identical |
| NEN EN IEC 62025-2 : 2005 | Identical |
| I.S. EN 62025-2:2005 | Identical |
| PN EN 62025-2 : 2005 | Identical |
| BS EN 62025-2:2005 | Identical |
| CEI EN 62025-2 : 2005 | Identical |
| EN 62025-2:2005 | Identical |
| DIN EN 62025-2:2005-08 | Identical |
| OVE/ONORM EN 62025-2 : 2005 | Identical |
| UNE-EN 62025-2:2005 | Identical |
| NF EN 62674-1 : 2013 | HIGH FREQUENCY INDUCTIVE COMPONENTS - PART 1: FIXED SURFACE MOUNT INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT |
| EN 62674-1 : 2012 | HIGH FREQUENCY INDUCTIVE COMPONENTS - PART 1: FIXED SURFACE MOUNT INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT (IEC 62674-1:2012) |
| BS EN 62674-1:2012 | High frequency inductive components Fixed surface mount inductors for use in electronic and telecommunication equipment |
| I.S. EN 62674-1:2012 | HIGH FREQUENCY INDUCTIVE COMPONENTS - PART 1: FIXED SURFACE MOUNT INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT (IEC 62674-1:2012 (EQV)) |
| IEC 62674-1:2012 | High frequency inductive components - Part 1: Fixed surface mount inductors for use in electronic and telecommunication equipment |
| 10/30219044 DC : 0 | BS EN 62674-1 - HIGH FREQUENCY INDUCTIVE COMPONENTS - FIXED SURFACE MOUNT INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT |
| IEC 61188-5-2:2003 | Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
| IEC 62211:2017 | Inductive components - Reliability management |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-27:2008 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 60068-2-77:1999 | Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock |
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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