• IEC 62025-2:2005

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    High frequency inductive components - Non-electrical characteristics and measuring methods - Part 2: Test methods for non-electrical characteristics

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Superseded date:  12-09-2022

    Language(s):  English - French

    Published date:  28-01-2005

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Test conditions
      4.1 Standard atmospheric conditions for test
      4.2 Referee conditions
    5 Mechanical characteristics test
      5.1 Body strength test
      5.2 Robustness of termination (electrode)
      5.3 Solderability
      5.4 Resistance to soldering heat
      5.5 Resistance to dissolution of metallization
      5.6 Vibration
      5.7 Resistance to shock
    Annex A (normative) Mounting of surface mounting inductor
                        to test printed-circuit board

    Abstract - (Show below) - (Hide below)

    Specifies a test method for the non-electrical characteristics of the surface mounted device inductors to be used for electronic and telecommunication equipment. Defines methods for measuring mechanical performance only. To be used in conjunction with IEC 62211.

    General Product Information - (Show below) - (Hide below)

    Committee TC 51
    Development Note Stability Date: 2018. (09/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Superseded
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    10/30219044 DC : 0 BS EN 62674-1 - HIGH FREQUENCY INDUCTIVE COMPONENTS - FIXED SURFACE MOUNT INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT
    BS EN 62674-1 : 2012 HIGH FREQUENCY INDUCTIVE COMPONENTS - PART 1: FIXED SURFACE MOUNT INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT
    NF EN 62674-1 : 2013 HIGH FREQUENCY INDUCTIVE COMPONENTS - PART 1: FIXED SURFACE MOUNT INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT
    I.S. EN 62674-1:2012 HIGH FREQUENCY INDUCTIVE COMPONENTS - PART 1: FIXED SURFACE MOUNT INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT (IEC 62674-1:2012 (EQV))
    IEC 62674-1:2012 High frequency inductive components - Part 1: Fixed surface mount inductors for use in electronic and telecommunication equipment
    EN 62674-1 : 2012 HIGH FREQUENCY INDUCTIVE COMPONENTS - PART 1: FIXED SURFACE MOUNT INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT (IEC 62674-1:2012)

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
    IEC 62211:2017 Inductive components - Reliability management
    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    IEC 60068-2-27:2008 Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
    IEC 60068-2-77:1999 Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock
    IEC 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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