IEC PAS 62326-7-1:2007
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Performance guide for single- and double-sided flexible printed wiring boards
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
31-12-2021
English
26-04-2007
Important note : Users cannot be edited or removed once added to your Multi user PDF.
1 Scope
2 Normative references
3 Terms and definitions
4 Test methods
5 Performance levels
6 Base materials
7 Visual inspection
7.1 Test environment
7.2 Test specimens
7.3 Tools for testing
7.4 Preparation of limit samples
7.5 Description of inspection
8 Dimensional inspections
8.1 Measurement of dimension
8.2 External dimension
8.3 Thickness
8.4 Hole diameter
8.5 Conductor width
8.6 Cumulative pattern pitch
8.7 Distance between hole centers
8.8 Design minimum distance between board edge and
conductor
8.9 Position accuracy
8.10 Registration of pressure sensitive or heatactivated
adhesive (Including adhesive squeeze-out) to flexible
printed board and stiffener
9 Electrical performance test
10 Mechanical performance test
11 Environmental performance
12 Chemical resistance
13 Cleanliness
14 Flame resistance
15 Marking, packaging, and storage
15.1 Marking on products
15.2 Marking on package
15.3 Packaging and storage
Annex A - Handling instruction manual handling of
polyimide-base FPC
Annex B - Ion migration test
Annex C - Whisker test
Annex D - Additional information - Explanation on JPCA
performance guide for single-and double-sided
flexible printed wiring boards
Provides the requirements for the single- and double-sided flexible printed wiring boards (hereinafter designated as "flexible printed board" or FPC)
| DevelopmentNote |
Stability Date: 2013. (10/2012)
|
| DocumentType |
Miscellaneous Product
|
| Pages |
41
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Withdrawn
|
| Standards | Relationship |
| DD IEC/PAS 62326-7-1:2007 | Identical |
| NEN NPR IEC/PAS 62326-7-1 : 2007 | Identical |
| BS EN 61191-3:2017 | Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies |
| BS EN 61191-1:2013 | Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| I.S. EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV)) |
| EN 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| I.S. EN 61191-3:2017 | PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| 15/30327712 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| 11/30255124 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| IEC 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
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