• I.S. EN 61191-1:2013

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))

    Available format(s):  Hardcopy, PDF

    Withdrawn date:  19-10-2021

    Language(s):  English

    Published date:  01-01-2013

    Publisher:  National Standards Authority of Ireland

    For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
    Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

    Dates of withdrawal of national standards are available from NSAI.

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 General requirements
    5 Materials requirements
    6 Components and printed board requirements
    7 Assembly process requirements
    8 Assembly soldering requirements
    9 Cleanliness requirements
    10 Assembly requirements
    11 Coating and encapsulation
    12 Rework and repair
    13 Product quality assurance
    14 Other requirements
    15 Ordering data
    Annex A (normative) - Requirements for soldering
            tools and equipment
    Annex B (normative) - Qualification of fluxes
    Annex C (normative) - Quality assessment
    Bibliography
    Annex ZA (normative) - Normative references to
             international publications with their
             corresponding European publications

    Abstract - (Show below) - (Hide below)

    Gives requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies.

    General Product Information - (Show below) - (Hide below)

    Development Note For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
    Document Type Standard
    Publisher National Standards Authority of Ireland
    Status Withdrawn

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 61193-3:2013 Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
    IEC 61193-1:2001 QUALITY ASSESSMENT SYSTEMS - PART 1: REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES
    IEC 61188-5-3:2007 Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
    IEC 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
    EN 60721-3-1 : 1997 CLASSIFICATION OF ENVIRONMENTAL CONDITIONS - CLASSIFICATION OF GROUPS OF ENVIRONMENTAL PARAMETERS AND THEIR SEVERITIES - STORAGE
    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    EN 61340-5-1:2016/AC:2017-05 ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS (IEC 61340-5-1:2016/COR1:2017)
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    IEC PAS 62326-7-1:2007 Performance guide for single- and double-sided flexible printed wiring boards
    J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    EN 61190-1-1 : 2002 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY
    IEC 61340-5-1:2016 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
    IEC 61188-1-1:1997 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - GENERIC REQUIREMENTS - FLATNESS CONSIDERATIONS FOR ELECTRONIC ASSEMBLIES
    IEC TR 61340-5-2:2007 Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide
    EN 61191-2 : 2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017)
    IEC 62326-1:2002 Printed boards - Part 1: Generic specification
    J STD 006 : C REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
    J STD 004 : B REQUIREMENTS FOR SOLDERING FLUXES
    IPC TM 650 : 0 TEST METHODS MANUAL
    IEC 61189-1:1997+AMD1:2001 CSV Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
    IPC PC 1990 : 1990 GENERAL REQUIREMENTS FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL
    IEC 62326-4:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
    IPC A 610 : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    EN 61189-3 : 2008 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS)
    J STD 005 : A REQUIREMENTS FOR SOLDERING PASTES
    J STD 002 : D SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
    IEC 61760-2:2007 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
    EN 61191-3 : 2017 PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES (IEC 61191-3:2017)
    IEC 61188-7:2017 Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
    IEC 61190-1-1:2002 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY
    IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
    IEC 61188-5-6:2003 Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
    IEC 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
    CLC/TR 61340-5-2:2008 ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    EN 61249-8-8 : 1997 Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
    IEC 61188-5-5:2007 Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
    ISO 9001:2015 Quality management systems Requirements
    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    IEC 62326-4-1:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C
    EN 61760-2 : 2007 SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE
    EN 61189-1 : 97 AMD 1 2001 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 1: GENERAL TEST METHODS AND METHODOLOGY
    IPC OI 645 : 0 STANDARD FOR VISUAL OPTICAL INSPECTION AIDS
    EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
    IEC 61188-5-4:2007 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES
    J STD 003 : C SOLDERABILITY TESTS FOR PRINTED BOARDS
    IEC 61249-8-8:1997 MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 8: TEMPORARY POLYMER COATINGS
    IPC SM 817 : A GENERAL REQUIREMENTS FOR DIELECTRIC SURFACE MOUNTING ADHESIVES
    EN 61190-1-2 : 2014 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
    J STD 020 : D-1 MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES
    IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
    EN 61188-1-1 : 1997 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 1-1: GENERIC REQUIREMENTS - FLATNESS CONSIDERATIONS FOR ELECTRONIC ASSEMBLIES
    EN 60194 : 2006 PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY - TERMS AND DEFINITIONS
    IEC 60721-3-1:1997 CLASSIFICATION OF ENVIRONMENTAL CONDITIONS - PART 3-1: CLASSIFICATION OF GROUPS OF ENVIRONMENTAL PARAMETERS AND THEIR SEVERITIES - STORAGE
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
    EN 61191-4 : 2017 PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
    IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
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