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IEC TS 61967-3:2014

Current

Current

The latest, up-to-date edition.

Integrated circuits - Measurement of electromagnetic emissions - Part 3: Measurement of radiated emissions - Surface scan method

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

25-08-2014

€244.32
Excluding VAT

IEC TS 61967-3:2014 provides a test procedure which defines an evaluation method for the near electric, magnetic or electromagnetic field components at or near the surface of an integrated circuit (IC). This diagnostic procedure is intended for IC architectural analysis such as floor planning and power distribution optimization. This test procedure is applicable to measurements on an IC mounted on any circuit board that is accessible to the scanning probe. In some cases it is useful to scan not only the IC but also its environment. For comparison of surface scan emissions between different ICs, the standardized test board defined in IEC 61967-1 should be used. This measurement method provides a mapping of the electric or magnetic near-field emissions over the IC. The resolution of the measurement is determined by the capability of the measurement probe and the precision of the probe-positioning system. This method is intended for use up to 6 GHz. Extending the upper limit of frequency is possible with existing probe technology but is beyond the scope of this specification. Measurements may be carried out in the frequency domain or in the time domain. This edition includes the following significant technical changes with respect to the previous edition:
a) Removal of: Clause 9.4 Data analysis and Annex D Analysing the data from near-field surface scanning;
b) Addition of: Introduction, Clause 9.4 Measurement data, Clause 9.5 Post-processing, Clause 9.6 Data exchange and Annex D Coordinate systems;
c) Expansion of: Clause 8.4 Test technique and Annex A Calibration of near-field probes.

DevelopmentNote
Stability date: 2019. (08/2014)
DocumentType
Technical Specification
Pages
73
PublisherName
International Electrotechnical Committee
Status
Current
Supersedes

Standards Relationship
DIN IEC/TS 61967-3 : 2015 Identical
PD IEC/TS 61967-3:2014 Identical
VDE V 0847-21-3 : 2015 Identical
NEN NPR IEC/TS 61967-3 : 2005 Identical

PD IEC/TR 61967-4-1:2005 Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz Measurement of conducted emissions. 1 Ohm/150 Ohm direct coupling method. Application guidance to IEC 61967-4
EN 62433-3:2017 EMC IC modelling - Part 3: Models of Integrated Circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE)
CEI EN 62433-3 : 1ED 2017 EMC IC MODELLING - PART 3: MODELS OF INTEGRATED CIRCUITS FOR EMI BEHAVIOURAL SIMULATION - RADIATED EMISSIONS MODELLING (ICEMRE)
EN IEC 62969-1:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors
I.S. EN 61967-5:2003 INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 5: MEASUREMENT OF CONDUCTED EMISSIONS - WORKBENCH FARADAY CAGE METHOD
I.S. EN 62433-3:2017 EMC IC MODELLING - PART 3: MODELS OF INTEGRATED CIRCUITS FOR EMI BEHAVIOURAL SIMULATION - RADIATED EMISSIONS MODELLING (ICEM-RE)
IEC 62969-1:2017 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors
PD IEC/TS 62132-9:2014 Integrated circuits. Measurement of electromagnetic immunity Measurement of radiated immunity. Surface scan method
PD IEC/TR 61967-1-1:2015 Integrated circuits. Measurement of electromagnetic emissions General conditions and definitions. Near-field scan data exchange format
BS EN 62433-3:2017 EMC IC modelling Models of integrated Circuits for EMI behavioural simulation. Radiated emissions modelling (ICEM-RE)
07/30163156 DC : 0 BS EN 62433-2 - MODELS OF INTEGRATED CIRCUITS FOR EMI BEHAVIOURAL SIMULATION - ICEM-CE, ICEM CONDUCTED EMISSION MODEL
IEC TR 61967-1-1:2015 Integrated circuits - Measurement of electromagnetic emissions - Part 1-1: General conditions and definitions - Near-field scan data exchange format
IEC TS 62132-9:2014 Integrated circuits - Measurement of electromagnetic immunity - Part 9: Measurement of radiated immunity - Surface scan method
IEC 62433-3:2017 EMC IC modelling - Part 3: Models of integrated circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE)
16/30336986 DC : 0 BS EN 62969-1 - SEMICONDUCTOR DEVICES - SEMICONDUCTOR INTERFACE FOR AUTOMOTIVE VEHICLES - PART 1: GENERAL REQUIREMENTS OF POWER INTERFACE FOR AUTOMOTIVE VEHICLE SENSORS

IEC 61967-1:2002 Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 1: General conditions and definitions
IEC TR 61967-1-1:2015 Integrated circuits - Measurement of electromagnetic emissions - Part 1-1: General conditions and definitions - Near-field scan data exchange format
IEC 61967-6:2002+AMD1:2008 CSV Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method

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