IPC 4204 : A
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY
Hardcopy
22-02-2019
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1 SCOPE
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
4 QUALITY ASSURANCE PROVISIONS
5 PREPARATION FOR DELIVERY
6 NOTES
Sets up the classification system, the qualification and quality performance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible printed circuitry and flexible flat cable.
| Committee |
D-10
|
| DevelopmentNote |
Supersedes IPC FC 241. (06/2002) Included in IPC C 102. (06/2008) Included in IPC C 1000. (07/2008) Also available in Chinese Language, See IPC 4204 CHINESE. (02/2014)
|
| DocumentType |
Standard
|
| Pages |
64
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| IEC PAS 61249-3-1:2007 | Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types) |
| IPC 2223 CHINESE : C | SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS |
| IPC 2221 GERMAN : B | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC CH 65 : B | GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
| IPC 6010 SERIES : LATEST | IPC-6010 QUALIFICATION AND PERFORMANCE SERIES |
| IPC CH 65 CHINESE : B | GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
| IPC 2223 GERMAN : C | SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS |
| IPC FLXCSP0605-CD : 2005 | IPC INTERNATIONAL CONFERENCE ON FLEXIBLE CIRCUITS, CHIP SCALE PACKAGING AND RADIO FREQUENCY IDENTIFICATION |
| IPC FLXCSP0706-CD : 2006 | IPC INTERNATIONAL CONFERENCE ON FLEXIBLE CIRCUITS AND CHIP SCALE PACKAGING |
| IPC 6013 GERMAN : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
| DD IEC/PAS 61249-3-1:2007 | Materials for printed boards and other interconnecting structures Copper-clad laminates for flexible boards (adhesive and non-adhesive types) |
| BS EN 16602-70-12:2016 | Space product assurance. Design rules for printed circuit boards |
| EN 16602-70-12:2016 | Space product assurance - Design rules for printed circuit boards |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 2221 FRENCH : B2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| DSCC 11006 : 0 | PRINTED WIRING BOARD, FLEXIBLE RIGID FLEX, GENERAL DRAWING |
| IPC 6013 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| ISO/IEC 17025:2005 | General requirements for the competence of testing and calibration laboratories |
| IPC 4202 : A | FLEXIBLE BASE DIELECTRICS FOR USE IN FLEXIBLE PRINTED BOARDS |
| IPC 4203 : A | COVER AND BONDING MATERIAL FOR FLEXIBLE PRINTED CIRCUITRY |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| ANSI/NCSL Z540 1 : 94(R2002) | CALIBRATION - CALIBRATION LABORATORIES AND MEASURING AND TEST EQUIPMENT - GENERAL REQUIREMENTS |
| ASTM D 2520 : 2013 | Standard Test Methods for Complex Permittivity (Dielectric Constant) of Solid Electrical Insulating Materials at Microwave Frequencies and Temperatures to 1650<sup>o</sup>C |
| IPC 4562 : A | METAL FOIL FOR PRINTED BOARD APPLICATIONS |
| ISO 10012-1:1992 | Quality assurance requirements for measuring equipment Part 1: Metrological confirmation system for measuring equipment |
| IPC 9191 : 0 | GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC) |
| ASTM D 374 : 1999 | Standard Test Methods for Thickness of Solid Electrical Insulation |
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