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IPC 4563 : 0

Current

Current

The latest, up-to-date edition.

RESIN COATED COPPER FOIL FOR PRINTED BOARDS GUIDELINE

Available format(s)

Hardcopy

Language(s)

English

Published date

02-11-2008

1 SCOPE
  1.1 Classification
       1.1.1 Material Supplier Designator
       1.1.2 C-Stage Resin Layer
       1.1.3 Thickness of the C-Stage Layer
       1.1.4 Resin Type of the C-Stage Layer
       1.1.5 Separator for C- and B-Stage Information
       1.1.6 B-Stage Layer
       1.1.7 Thickness of the B-Stage Layer
       1.1.8 Resin Type of the B-Stage Layer
       1.1.9 Copper Foil Thickness
       1.1.10 Copper Foil Type
       1.1.11 Copper Foil Profile
       1.1.12 Material Property Sheet Description
       1.1.13 Color
2 APPLICABLE DOCUMENTS
  2.1 IPC
  2.2 Underwriters Laboratories
  2.3 National Conference of Standards Laboratories (NCSL)
  2.4 International Standards
3 REQUIREMENTS
  3.1 Terms and Definitions
       3.1.1 Qualification Assessment
       3.1.2 Quality Conformance Testing
       3.1.3 Manufacturer's Quality System
       3.1.4 Process Control Testing
       3.1.5 Self Declaration
       3.1.6 Quality Assessment Data
       3.1.7 Sample Qualification
       3.1.8 Production Data
       3.1.9 User Test Data
       3.1.10 Internal Assessment
       3.1.11 Individual User Audit
       3.1.12 Independent Third Party Assessment
  3.2 Material Property Sheets
  3.3 Manufacturing Supplier's Quality Profile
  3.4 Qualification Testing
  3.5 Verification of Manufacturing Supplier's Quality
       System
  3.6 Conflict
  3.7 Materials
       3.7.1 Metal Cladding
       3.7.2 Resin Systems
  3.8 General Requirements/Acceptability
       3.8.1 Fabricated Panel
       3.8.2 Fabricated Rolls
       3.8.3 Inspection Lot
       3.8.4 Visual Properties
  3.9 Dimensions
       3.9.1 Copper Foil Roll Width
       3.9.2 Roll Coating Width
       3.9.3 Coated Foil Roll Length
       3.9.4 Coated Foil Panel Length and Width
       3.9.5 Panel Coating Width
       3.9.6 Thickness
  3.10 Physical Properties
       3.10.1 Peel Strength After Thermal Stress
       3.10.2 Peel Strength At Elevated Temperature
       3.10.3 Curling
       3.10.4 Coating Thickness
  3.11 Chemical Properties
       3.11.1 Flammability
       3.11.2 Thermal Stress - Un-Etched
       3.11.3 Glass Transition Temperature
       3.11.4 Chemical Resistance
       3.11.5 Low Halogen Content
  3.12 Electrical
       3.12.1 Permittivity
       3.12.2 Loss Tangent
  3.13 Environmental
       3.13.1 Moisture Resistance
  3.14 B-Stage Performance
       3.14.1 Desired Flow
       3.14.2 Desired Volatile Content
       3.14.3 Desired Viscosity
  3.15 Shelf Life
  3.16 Marking
       3.16.1 Marking Panels and Rolls
       3.16.2 Marking of Shipping Containers
  3.17 Workmanship
  3.18 Material Safety
4 QUALITY ASSURANCE PROVISIONS
  4.1 Quality System
  4.2 Responsibility for Inspection
       4.2.1 Test Equipment and Inspection Facilities
  4.3 Qualification Testing
       4.3.1 Samples
       4.3.2 Frequency
       4.3.3 Laminator Qualification Profile
       4.3.4 Changes in Composition
       4.3.5 Qualification Data Retention
  4.4 Quality Conformance Inspection
       4.4.1 Frequency
       4.4.2 Acceptance Criteria
       4.4.3 Rejected Lots
       4.4.4 Conformance Data Retention
       4.4.5 Certificate of Conformance
  4.5 Statistical Process Control (SPC)
5 PREPARATION FOR DELIVERY
  5.1 Packaging Materials
  5.2 Authorized Agents/Distributors
6 NOTES
  6.1 Ordering Data for Coated Copper Foil Materials:
  6.2 New Materials
Example Material Property Sheet

Covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies.

Committee
3-10
DevelopmentNote
Supersedes IPC CF 148. (02/2008) Included in IPC C 107. (06/2008) Included in IPC C 105 & IPC C 1000. (07/2008)
DocumentType
Standard
Pages
19
PublisherName
Institute of Printed Circuits
Status
Current
Supersedes

IPC 6012 RUSSIAN : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC 2221 GERMAN : B GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 6012 POLISH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC 7092 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS
IPC 6012 FRENCH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC 6013 GERMAN : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS
IPC 4101 CHINESE : C2009 SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IPC 6018 CHINESE : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD
IPC 4101 GERMAN : C SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 2221 FRENCH : B2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
DSCC 10012 : 0 PRINTED WIRING BOARD, RIGID, MULTILAYERED, GENERAL DRAWING
DSCC 11006 : 0 PRINTED WIRING BOARD, FLEXIBLE RIGID FLEX, GENERAL DRAWING
IPC 6013 CHINESE : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS

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