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  • IPC 5702 : 0

    Current The latest, up-to-date edition.

    GUIDELINES FOR OEMS IN DETERMINING ACCEPTABLE LEVELS OF CLEANLINESS OF UNPOPULATED PRINTED BOARDS

    Available format(s):  Hardcopy

    Language(s):  English

    Published date:  01-06-2007

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 SCOPE
    2 APPLICABLE DOCUMENTS
      2.1 IPC
      2.2 Joint Industry Standards
      2.3 Telcordia
      2.4 Radio Technical Commission for Aeronautics
    3 THE PROBLEM WITH UNDERSTANDING CLEANLINESS DATA
      3.1 Where to Start
    4 LAB TESTS
    5 ENVIRONMENTAL STRESS SCREENING (ESS) TESTING
    6 SUGGESTED APPROACH
    7 SUMMARY
    Appendix A - ROSE TESTING

    Abstract - (Show below) - (Hide below)

    Covers many aspects of how cleanliness is measured on printed boards, as well as many critical factors to consider when specifying board cleanliness in purchasing documents.

    General Product Information - (Show below) - (Hide below)

    Committee 5-30
    Development Note Included in IPC C 108. (06/2008) Included in IPC C 1000. (07/2008)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
    BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
    IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC A 52-G : 2006 CLEANLINESS AND RESIDUE EVALUATION TEST BOARD
    IPC HDBK 830 : A GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS
    MIL-STD-883 Revision K:2016 TEST METHOD STANDARD - MICROCIRCUITS
    MIL-STD-810 Revision G:2008 ENVIRONMENTAL ENGINEERING CONSIDERATIONS AND LABORATORY TESTS
    IPC J STD 004 : B REQUIREMENTS FOR SOLDERING FLUXES
    IPC TM 650 : 0 TEST METHODS MANUAL
    IPC HDBK 001 : E HANDBOOK AND GUIDE TO SUPPLEMENT J-STD-001
    IPC TR 476 : A1997 ELECTROCHEMICAL MIGRATION: ELECTRICALLY INDUCED FAILURES IN PRINTED WIRING ASSEMBLIES
    IPC 9691 : A USER GUIDE FOR THE IPC-TM-650, METHOD 2.6.25, CONDUCTIVE ANODIC FILAMENT (CAF) RESISTANCE AND OTHER INTERNAL ELECTROCHEMICAL MIGRATION TESTING
    IPC TR 583 : 0 AN IN-DEPTH LOOK AT IONIC CLEANLINESS TESTING
    IPC 9201 : A SURFACE INSULATION RESISTANCE HANDBOOK
    IPC HDBK 840 : 0 SOLDER MASK HANDBOOK
    IPC 5701 : 0 USERS GUIDE FOR CLEANLINESS OF UNPOPULATED PRINTED BOARDS
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