IPC 9707 : 0
Current
The latest, up-to-date edition.
SPHERICAL BEND TEST METHOD FOR CHARACTERIZATION OF BOARD LEVEL INTERCONNECTS
Hardcopy
English
01-05-2018
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FOREWORD
INTRODUCTION
1 SCOPE
2 APPLICABLE DOCUMENTS
3 TERMS AND DEFINITIONS
4 SAMPLE SIZE
5 APPARATUS AND SETUP
6 TEST VEHICLES
7 TEST PROCEDURE
8 FAILURE CRITERIA AND ANALYSIS
ANNEX A (INFORMATIVE) - FAILURE ANALYSIS TECHNIQUES
Qualifies the maximum allowable strain that a surface mount component's board level interconnects can withstand in flexural loading.
| DevelopmentNote |
Included in IPC C 103 & IPC C 1000. Jointly published by IPC and JEDEC. (09/2011)
|
| DocumentType |
Standard
|
| Pages |
7
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| IPC 9704 CHINESE : - | PRINTED WIRING BOARD STRAIN GAGE TEST GUIDELINE |
| IPC 9709 : 0 | TEST GUIDELINES FOR ACOUSTIC EMISSION MEASUREMENT DURING MECHANICAL TESTING |
| IPC 9704 : A | PRINTED CIRCUIT ASSEMBLY STRAIN GAGE TEST GUIDELINE |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IPC 9704 : A | PRINTED CIRCUIT ASSEMBLY STRAIN GAGE TEST GUIDELINE |
| IPC 9703 : 0 | IPC/JEDEC MECHANICAL SHOCK TEST GUIDELINES FOR SOLDER JOINT RELIABILITY |
| IPC 7093 : 0 | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IPC 9701 : A | PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS |
| IPC 9702 : 0 | MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS |
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