IPC BP 421 : 80(R1990)
Withdrawn
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
GENERAL SPECIFICATION FOR RIGID PRINTED BOARD BACKPLANES WITH PRESS-FIT CONTACTS
Published date
12-01-2013
Publisher
Withdrawn date
23-07-2013
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NO CONTENTS SECTION
Covers the design, fabrication and end-product requirements for rigid printed-board backplane assemblies with press-fit contacts.
| DocumentType |
Standard
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Withdrawn
|
| Supersedes |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| MIL-STD-130 Revision N:2007 | Identification Marking of U.S. Military Property |
| MIL-C-28859 Revision B:1990 | Connector Component Parts, Electrical Backplane, Printed-Wiring, General Specification For |
| MIL-STD-1130 Revision C:2012 | Connections, Electrical, Solderless Wrapped |
| MIL-I-46058 Revision C:1972 | Insulating Compound, Electrical (for Coating Printed Circuit Assemblies) |
| IPC D 300 : G1984 | PRINTED BOARD DIMENSIONS AND TOLERANCES |
| IPC DW 425 : A | DESIGN AND END PRODUCT REQUIREMENTS FOR DISCRETE WIRING BOARDS |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IPC SM 840 : E | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
| IPC L 108 : B | SPECIFICATION FOR THIN METAL CLAD BASE MATERIALS FOR MULTILAYER PRINTED BOARDS |
| IPC L 115 : B | SPECIFICATION FOR RIGID METAL-CLAD BASE MATERIALS FOR PRINTED BOARDS |
| IPC A 610 : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| MIL G 45204 : C | GOLD PLATING, ELECTRODEPOSITED |
| IPC L 110 : A | PREIMPREGNATED, B-STAGE EPOXY-GLASS CLOTH FOR MULTILAYER PRINTED CIRCUIT BOARDS |
| IPC D 310 : C | GUIDELINES FOR PHOTOTOOL GENERATION AND MEASUREMENT TECHNIQUES |
| QQ-C-533 Revision B:1972 | Copper-Beryllium Alloy Strip (Copper Numbers 170 and 172) (S/S by ASTM-B194) |
| IPC ML 910 : A1976 | RIGID MULTILAYER PRINTED BOARDS, DESIGN AND END PRODUCTION, SPECIFICATION FOR, |
| IPC D 390 : A | AUTOMATED DESIGN GUIDELINES |
| IPC L 109 : B | SPECIFICATION FOR RESIN PREIMPREGNATED FABRIC (PREPREG) FOR MULTILAYER PRINTED BOARDS |
| QQ-B-750 Base Document:1961 | Bronze, Phosphor; Bar, Plate, Rod, Sheet, Strip, Flat Wire, and Structural and Special Shaped Sections (S/S by ASTM-B139) |
| NEMA LI 1 : 1998(R2011) | INDUSTRIAL LAMINATED THERMOSETTING PRODUCTS |
| MIL C 21097 : E | CONNECTORS, ELECTRICAL, PRINTED WIRING BOARD, GENERAL PURPOSE GENERAL SPECIFICATION FOR |
| QQ-N-290 Revision A:1971 | NICKEL PLATING (ELECTRODEPOSITED) (S/S BY SAE-AMS-QQ-N-290) |
| IPC L 130 : 1977 | SPECIFICATION FOR THIN LAMINATES, METAL-CLAD, PRIMARILY FOR GENERAL PURPOSE MULTILAYER PRINTED BOARDS |
Summarise
Sorry this product is not available in your region.