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IPC ML 910 : A1976

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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RIGID MULTILAYER PRINTED BOARDS, DESIGN AND END PRODUCTION, SPECIFICATION FOR,

Published date

23-11-2012

Superseded date

01-01-1991

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Outlines design and product provisions for rigid multilayer printed boards consisting of several layers of conductor patterns on insulating bases separated by an insulating material and interconnected by a continuous metallic interlayer connection.

DocumentType
Standard
PublisherName
IPC by Global Electronics Association
Status
Superseded
SupersededBy

IPC BP 421 : 80(R1990) GENERAL SPECIFICATION FOR RIGID PRINTED BOARD BACKPLANES WITH PRESS-FIT CONTACTS

ANSI Y14.5 : 1973 DIMENSIONING AND TOLERANCING FOR ENGINEERING DRAWINGS
IPC A 600 : H ACCEPTABILITY OF PRINTED BOARDS
IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
MIL-I-46058 Revision C:1972 Insulating Compound, Electrical (for Coating Printed Circuit Assemblies)
IPC ML 975 : 1969 END PRODUCT DOCUMENTATION SPECIFICATION FOR MULTILAYER PRINTED WIRING BOARDS
IPC TM 650 : 0 TEST METHODS MANUAL
IPC L 108 : B SPECIFICATION FOR THIN METAL CLAD BASE MATERIALS FOR MULTILAYER PRINTED BOARDS
MIL G 45204 : C GOLD PLATING, ELECTRODEPOSITED
IPC L 110 : A PREIMPREGNATED, B-STAGE EPOXY-GLASS CLOTH FOR MULTILAYER PRINTED CIRCUIT BOARDS
MIL-C-14550 Revision B:1983 Copper Plating (Electrodeposited) (S/S by SAE-AMS2418)
IPC L 109 : B SPECIFICATION FOR RESIN PREIMPREGNATED FABRIC (PREPREG) FOR MULTILAYER PRINTED BOARDS
IPC AM 372 : 1978 ELECTROLESS COPPER FILM FOR ADDITIVE PRINTED BOARDS,
QQ-N-290 Revision A:1971 NICKEL PLATING (ELECTRODEPOSITED) (S/S BY SAE-AMS-QQ-N-290)
IPC ML 950 : C1980 RIGID MULTILAYER PRINTED BOARDS, PERFORMANCE SPECIFICATION FOR,
IPC FC 150 : E COPPER FOIL FOR PRINTED WIRING APPLICATIONS

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