IPC DD 135 : 0
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
QUALIFICATION TESTING FOR DEPOSITED ORGANIC INTERLAYER DIELECTRIC MATERIALS FOR MULTICHIP MODULES
23-07-2013
1 SCOPE
1.1 Scope
1.2 Purpose
1.3 Classes
2 APPLICABLE DOCUMENTS
2.1 IPC
2.2 ASTM
3 PREPARATION FOR SPECIMENS FOR TEST
3.1 Scope
3.2 Specimen Configuration
3.3 Precautions
3.4 Apparatus
3.5 Procedure
3.6 Reporting of Specimen Processing History
4 MATERIAL PROPERTY TESTING AND REPORTING
4.1 Notes
4.2 Methods of Examination and Test
4.3 Property Reporting
5 REFERENCES
Gives information about the deposited organic interlayer dielectric materials under evaluation for MCM-D applications. The standard and test methods have been written without bias towards any particular class of materials.
| DevelopmentNote |
Also available in CD-ROM format. (09/2005)
|
| DocumentType |
Standard
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Withdrawn
|
| IPC HM 860 : 0 | SPECIFICATION FOR MULTILAYER HYBRID CIRCUITS |
| IEC PAS 62250:2001 | Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1) |
| IPC 6012 RUSSIAN : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC 6012 POLISH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC 6012 FRENCH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC 6013 GERMAN : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
| IPC D 859 : 0 | DESIGN STANDARD FOR THICK FILM MULTILAYER HYBRID CIRCUITS |
| IPC 6015 : 0 | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR ORGANIC MULTICHIP MODULE MOUNTING AND INTERCONNECTING STRUCTURES |
| IEC PAS 62249:2001 | Qualification and performance specification for flexible printed boards |
| IPC 6013 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
| IPC S 100 : LATEST | STANDARDS AND SPECIFICATIONS MANUAL |
| IPC E 500 : LATEST | IPC ELECTRONIC DOCUMENT COLLECTION |
| IPC MC 790 : 0 | GUIDELINES FOR MULTICHIP MODULE TECHNOLOGY UTILIZATION |
| IPC 4104 : 1999 | SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) AND MICROVIA MATERIALS |
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