• IPC HDBK 850 : 0

    Current The latest, up-to-date edition.

    GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF POTTING MATERIALS AND ENCAPSULATION PROCESSES USED FOR ELECTRONICS PRINTED CIRCUIT BOARD ASSEMBLY

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    Published date:  31-07-2012

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 SCOPE
    2 APPLICABLE DOCUMENTS
    3 P/E MATERIALS
    4 ELECTRICAL CONSIDERATIONS
    5 REWORK AND REPAIR
    6 END USE ENVIRONMENT
    7 LONG TERM RELIABILITY AND TESTING
    8 EQUIPMENT CONSIDERATIONS
    9 DESIGN CONSIDERATIONS IN P/E
    10 ENCLOSURE CONSIDERATIONS
    11 PREPARATION FOR P/E
    12 DISPENSING
    13 CURE MECHANISMS
    14 APPLICATION PROCESS MONITORING
    15 ENVIRONMENTAL, HEALTH AND SAFETY PROCESSING CONSIDERATIONS
    16 INHIBITION
    17 POTTING/COATING OVER ENCAPSULANTS
    18 MATERIALS RELATED TO LEAD FREE PROCESSING THAT
       AFFECT P/E
    19 REWORK AND REPAIR PROCESSES
    20 REGULATIONS
    APPENDIX A - MSDS
    APPENDIX B - Reference Documents

    Abstract - (Show below) - (Hide below)

    Helps the designers and users of potting and encapsulation in understanding the characteristics of various materials, as well as the factors that can modify those characteristics when the potting or encapsulation is applied.

    General Product Information - (Show below) - (Hide below)

    Development Note Also available in CD-ROM format. (05/2016) Also available in Hardcopy format. (01/2018)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC HDBK 830 : A GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS
    SAE AS 12500 : 2018 CORROSION PREVENTION AND DETERIORATION CONTROL IN ELECTRONIC COMPONENTS AND ASSEMBLIES

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC HDBK 830 : A GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS
    IEC 61086-2:2004 Coatings for loaded printed wire boards (conformal coatings) - Part 2: Methods of test
    IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IEC 61086-3-1:2004 Coatings for loaded printed wire boards (conformal coatings) - Part 3-1: Specifications for individual materials - Coatings for general purpose (Class 1), high reliability (Class 2) and aerospace (Class 3)
    IPC CC 830 : B QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES
    ASTM E 595 : 2015 : REDLINE Standard Test Method for Total Mass Loss and Collected Volatile Condensable Materials from Outgassing in a Vacuum Environment
    IPC TM 650 : 0 TEST METHODS MANUAL
    ASTM D 5470 : 2017 : REDLINE Standard Test Method for Thermal Transmission Properties of Thermally Conductive Electrical Insulation Materials
    IPC CH 65 : B GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
    IPC D 279 : 0 DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES
    IPC 7711/21 : B REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES
    ASTM D 2520 : 2013 Standard Test Methods for Complex Permittivity (Dielectric Constant) of Solid Electrical Insulating Materials at Microwave Frequencies and Temperatures to 1650oC
    MIL-STD-202 Revision H:2015 ELECTRONIC AND ELECTRICAL COMPONENT PARTS
    ASTM D 570 : 1998 : R2018 Standard Test Method for Water Absorption of Plastics
    BS EN 61086-1:2004 Coatings for loaded printed wire boards (conformal coatings) Definitions, classification and general requirements
    ASTM F 1249 : 2013 : REDLINE Standard Test Method for Water Vapor Transmission Rate Through Plastic Film and Sheeting Using a Modulated Infrared Sensor
    IEC 61086-1:2004 Coatings for loaded printed wire boards (conformal coatings) - Part 1: Definitions, classification and general requirements
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