IPC J STD 001 SWEDISH : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC D 949 : 1987
|
RIGID MULTILAYER PRINTED BOARDS, DESIGN STANDARD FOR, |
IPC CC0201-CD : 2010
|
CONFORMAL COATING APPLICATIONS, INSPECTION, REWORK & QUALITY CONTROL INTERACTIVE CD-ROM |
IEC TS 62647-22:2013
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
IPC J STD 001 CHINESE : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
MIL-C-28809 Revision B:1988
|
CIRCUIT CARD ASSEMBLIES, RIGID, FLEXIBLE & RIGID FLEX |
IPC AJ 820 : A
|
ASSEMBLY AND JOINING HANDBOOK |
IPC 6012 RUSSIAN : C
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
IPC A 610 DANISH : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
MIL-PRF-32484 Base Document:2013
|
PROTECTIVE RELAYS AND ATTACHMENTS, MEDIUM VOLTAGE VACUUM CIRCUIT BREAKER APPLICATIONS |
IPC A 610 SPANISH : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
MIL-DTL-17361 Revision G:2006
|
CIRCUIT BREAKER TYPES AQB/NQB, AIR, ELECTRIC, LOW VOLTAGE, INSULATED HOUSING (SHIPBOARD USE), GENERAL SPECIFICATION FOR |
IPC A 610 ROMANIAN : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC 2221 GERMAN : B
|
GENERIC STANDARD ON PRINTED BOARD DESIGN |
IPC 6012 POLISH : C
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
MIL-DTL-32485 Base Document:2013
|
CIRCUIT BREAKERS, VACUUM TYPE (VCB), ELECTRIC POWER, MEDIUM VOLTAGE, ALTERNATING CURRENT, DRAW-OUT REMOVABLE CONSTRUCTION, WITHOUT INTERNAL OVERCURRENT PROTECTION |
IPC A 610 CZECH : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IEC TS 62647-2:2012
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin |
PD IEC/TS 62647-2:2012
|
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Mitigation of deleterious effects of tin |
IEC PAS 62588:2008
|
Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes |
IPC J STD 001 SPANISH : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
SAE AS 12500 : 2018
|
CORROSION PREVENTION AND DETERIORATION CONTROL IN ELECTRONIC COMPONENTS AND ASSEMBLIES |
MIL-DTL-24308-23 Revision G:2009
|
CONNECTORS, ELECTRIC, RECTANGULAR, NONENVIRONMENTAL, MINIATURE, POLARIZED SHELL, RACK AND PANEL, SOCKET CONTACTS PRINTED WIRING BOARD TERMINATION TYPES |
IPC J STD 001 GERMAN : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC A 610 HINDI : E2010
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
MIL-PRF-32192 Base Document:2005
|
RESISTOR, CHIP, THERMAL (THERMISTOR), GENERAL SPECIFICATION FOR |
PD IEC/TS 62647-22:2013
|
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines |
IPC J STD 001 FRENCH : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IEC PAS 62250:2001
|
Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1) |
IPC A 610 ESTONIAN : E2010
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 POLISH : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 DUTCH : F2014
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 KOREAN : F2014
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC J STD 001 DANISH : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC CC0509 : 2009
|
CONFORMAL COATING PHOTO GUIDE ON CD |
IPC HDBK 630 : 0
|
GUIDELINES FOR DESIGN, MANUFACTURE, INSPECTION AND TESTING OF ELECTRONIC ENCLOSURES ASSEMBLY |
IPC A 610 ITALIAN : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 FRENCH : F
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC HDBK 840 : 0
|
SOLDER MASK HANDBOOK |
IPC A 610 GERMAN : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
MIL-PRF-32159 Base Document:2004
|
Resistor, Chip, Fixed, Film, Zero OHM, Industrial, High Reliability, Space Level, General Specification for |
IPC 2221B:2012
|
GENERIC STANDARD ON PRINTED BOARD DESIGN |
MIL-PRF-31032-6 Revision B:2017
|
PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE SIDED, THERMOPLASTIC RESIN BASE MATERIAL, WITH OR WITHOUT PLATED-THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS |
IPC 6018 CHINESE : B
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD |
IPC HDBK 850 : 0
|
GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF POTTING MATERIALS AND ENCAPSULATION PROCESSES USED FOR ELECTRONICS PRINTED CIRCUIT BOARD ASSEMBLY |
IPC HDBK 830 : A
|
GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS |
MIL-DTL-32483 Base Document:2013
|
Switchgear, Power, Hard-Mounted, Medium Voltage, Naval Shipboard |
MIL-DTL-24308-24 Revision H:2009
|
CONNECTORS, ELECTRIC, RECTANGULAR, NONENVIRONMENTAL, MINIATURE, POLARIZED SHELL, RACK AND PANEL, PIN CONTACTS PRINTED WIRING BOARD TERMINATION TYPES |
IEC PAS 62647-2:2011
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of the deleterious effects of tin |
IPC J STD 001 HUNGARIAN : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC D 279 : 0
|
DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES |
IPC A 610 SWEDISH : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC J STD 609 : A
|
MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
GEIA HB 0005-2 : 2007
|
TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
IPC P-CC0509 : 2009
|
CONFORMAL COATING PHOTOGRAPHIC POSTER GUIDE |
IPC A 610 HUNGARIAN : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC 6012 FRENCH : C
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
IPC 2221 FRENCH : B2012
|
GENERIC STANDARD ON PRINTED BOARD DESIGN |
MIL-PRF-55342 Revision H:2003
|
RESISTOR, CHIP, FIXED, FILM, NONESTABLISHED RELIABILITY, ESTABLISHED RELIABILITY, SPACE LEVEL, GENERAL SPECIFICATION FOR |
IPC A 610 CHINESE : F
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC J STD 001 TURKISH : E2010
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 RUSSIAN : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 POLISH : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC A 610 TURKISH : E2010
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC J STD 609 CHINESE : A
|
IPC/JEDEC MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
IPC A 610 JAPANESE : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IEC PAS 62293:2001
|
Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016) |
IPC A 610 RUSSIAN : D
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 VIETNAMESE : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
MIL STD 11991 : A
|
GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES |
DD IEC/PAS 62588:2008
|
Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes |
IEC PAS 62647-22:2011
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
12/30262664 DC : DRAFT APR 2012
|
BS EN 62588 - MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
IPC J STD 001 ROMANIAN : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |