• IPC CC 830 : B

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES

    Available format(s): 

    Superseded date:  18-09-2023

    Language(s): 

    Published date:  01-09-2008

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 SCOPE
      1.1 Scope
      1.2 Purpose
      1.3 Classification
          1.3.1 Types
          1.3.2 Classes
      1.4 Interpretation
    2 APPLICABLE DOCUMENTS
      2.1 IPC
      2.2 Government
      2.3 American Society for Testing of Materials
      2.4 Underwriters Laboratories
      2.5 ANSI
      2.6 ISO
    3 REQUIREMENTS
      3.1 General Requirements
          3.1.1 Terms and Definitions
          3.1.2 Conflict
      3.2 Inspection and Testing Requirements
          3.2.1 Qualification Inspection and Testing
          3.2.2 Qualification Retention Inspection and Testing
          3.2.3 Quality Conformance Inspection Testing
          3.2.4 Additional Testing
      3.3 Materials Requirements
          3.3.1 Materials
          3.3.2 Shelf Life
          3.3.3 Cure
      3.4 Chemical Requirements
          3.4.1 Fourier Transform Infrared Spectroscopy Test (FTIR)
      3.5 Physical Requirements
          3.5.1 Viscosity
          3.5.2 Appearance
          3.5.3 Fluorescence
          3.5.4 Fungus Resistance
          3.5.5 Flexibility
          3.5.6 Flammability
      3.6 Electrical Requirements
          3.6.1 Dielectric Withstanding Voltage (DWV)
      3.7 Environmental Requirements
          3.7.1 Moisture and Insulation Resistance
          3.7.2 Thermal Shock
          3.7.3 Temperature and Humidity Aging (Hydrolytic Stability)
      3.8 Special Requirements
    4 QUALITY ASSURANCE PROVISION
      4.1 Responsibility for Inspection
      4.2 Categories of Inspection and Frequency
          4.2.1 Qualification Inspection
          4.2.2 Qualification Retention Inspection
          4.2.3 Quality Conformance Inspection
      4.3 Product Change
      4.4 Test Equipment and Inspection Facilities
          4.4.1 Standard Laboratory Conditions
          4.4.2 Permissible Temperature Variation in Environmental
                Chambers
          4.4.3 Reference Conditions
      4.5 Inspection Routine
      4.6 Inspection Sampling
          4.6.1 Test Vehicles
          4.6.2 Sample Size
          4.6.3 Preparation Prior to Coating
          4.6.4 Coating
      4.7 Failures
      4.8 Inspection Reporting
          4.8.1 Qualification Reporting
          4.8.2 Qualification Retention Reporting
          4.8.3 Quality Conformance Reporting
    5 PREPARATION FOR DELIVERY
      5.1 Containers
      5.2 Packaging
      5.3 Marking
    6 NOTES
      6.1 Order Data
      6.2 Formulation Change
      6.3 Conditioning
      6.4 Cleanliness
      6.5 Adhesion
      6.6 Solvent Compatibility
      6.7 Identification of Solvent Sensitive Conformal Coatings
    Appendix A - Example of Qualification Inspection Report
    Appendix B - Example of Qualification Retention Inspection
                 Report
    Appendix C - Example of Quality Conformance Inspection Report

    Abstract - (Show below) - (Hide below)

    Establishes qualification and conformance requirements for electrical insulating compounds (conformal coatings). Intends to obtain maximum confidence in the materials with minimum test redundancy. Covers: - The qualification and qualification retention of the conformal coating material. - The quality conformance of conformal coating material properties.

    General Product Information - (Show below) - (Hide below)

    Committee 5-30
    Development Note Included in IPC C 103 & IPC C 1000. B2002 Edition Re-Issued in October 2008 & incorporates AMD 1 2008. Also available in Chinese Language, See IPC CC 830 CHINESE. (07/2009) Also numbered as IEC PAS 61249-8-1. (06/2014)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC J STD 001 SWEDISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC D 949 : 1987 RIGID MULTILAYER PRINTED BOARDS, DESIGN STANDARD FOR,
    IPC CC0201-CD : 2010 CONFORMAL COATING APPLICATIONS, INSPECTION, REWORK & QUALITY CONTROL INTERACTIVE CD-ROM
    IEC TS 62647-22:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    IPC J STD 001 CHINESE : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    MIL-C-28809 Revision B:1988 CIRCUIT CARD ASSEMBLIES, RIGID, FLEXIBLE & RIGID FLEX
    IPC AJ 820 : A ASSEMBLY AND JOINING HANDBOOK
    IPC 6012 RUSSIAN : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
    IPC A 610 DANISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    MIL-PRF-32484 Base Document:2013 PROTECTIVE RELAYS AND ATTACHMENTS, MEDIUM VOLTAGE VACUUM CIRCUIT BREAKER APPLICATIONS
    IPC A 610 SPANISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    MIL-DTL-17361 Revision G:2006 CIRCUIT BREAKER TYPES AQB/NQB, AIR, ELECTRIC, LOW VOLTAGE, INSULATED HOUSING (SHIPBOARD USE), GENERAL SPECIFICATION FOR
    IPC A 610 ROMANIAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC 2221 GERMAN : B GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC 6012 POLISH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
    MIL-DTL-32485 Base Document:2013 CIRCUIT BREAKERS, VACUUM TYPE (VCB), ELECTRIC POWER, MEDIUM VOLTAGE, ALTERNATING CURRENT, DRAW-OUT REMOVABLE CONSTRUCTION, WITHOUT INTERNAL OVERCURRENT PROTECTION
    IPC A 610 CZECH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IEC TS 62647-2:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin
    PD IEC/TS 62647-2:2012 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Mitigation of deleterious effects of tin
    IEC PAS 62588:2008 Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes
    IPC J STD 001 SPANISH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    SAE AS 12500 : 2018 CORROSION PREVENTION AND DETERIORATION CONTROL IN ELECTRONIC COMPONENTS AND ASSEMBLIES
    MIL-DTL-24308-23 Revision G:2009 CONNECTORS, ELECTRIC, RECTANGULAR, NONENVIRONMENTAL, MINIATURE, POLARIZED SHELL, RACK AND PANEL, SOCKET CONTACTS PRINTED WIRING BOARD TERMINATION TYPES
    IPC J STD 001 GERMAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC A 610 HINDI : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    MIL-PRF-32192 Base Document:2005 RESISTOR, CHIP, THERMAL (THERMISTOR), GENERAL SPECIFICATION FOR
    PD IEC/TS 62647-22:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines
    IPC J STD 001 FRENCH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IEC PAS 62250:2001 Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1)
    IPC A 610 ESTONIAN : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC A 610 POLISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC A 610 DUTCH : F2014 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC A 610 KOREAN : F2014 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC J STD 001 DANISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC CC0509 : 2009 CONFORMAL COATING PHOTO GUIDE ON CD
    IPC HDBK 630 : 0 GUIDELINES FOR DESIGN, MANUFACTURE, INSPECTION AND TESTING OF ELECTRONIC ENCLOSURES ASSEMBLY
    IPC A 610 ITALIAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC A 610 FRENCH : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC HDBK 840 : 0 SOLDER MASK HANDBOOK
    IPC A 610 GERMAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    MIL-PRF-32159 Base Document:2004 Resistor, Chip, Fixed, Film, Zero OHM, Industrial, High Reliability, Space Level, General Specification for
    IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    MIL-PRF-31032-6 Revision B:2017 PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE SIDED, THERMOPLASTIC RESIN BASE MATERIAL, WITH OR WITHOUT PLATED-THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS
    IPC 6018 CHINESE : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD
    IPC HDBK 850 : 0 GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF POTTING MATERIALS AND ENCAPSULATION PROCESSES USED FOR ELECTRONICS PRINTED CIRCUIT BOARD ASSEMBLY
    IPC HDBK 830 : A GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS
    MIL-DTL-32483 Base Document:2013 Switchgear, Power, Hard-Mounted, Medium Voltage, Naval Shipboard
    MIL-DTL-24308-24 Revision H:2009 CONNECTORS, ELECTRIC, RECTANGULAR, NONENVIRONMENTAL, MINIATURE, POLARIZED SHELL, RACK AND PANEL, PIN CONTACTS PRINTED WIRING BOARD TERMINATION TYPES
    IEC PAS 62647-2:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of the deleterious effects of tin
    IPC J STD 001 HUNGARIAN : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC D 279 : 0 DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES
    IPC A 610 SWEDISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC J STD 609 : A MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES
    GEIA HB 0005-2 : 2007 TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
    IPC P-CC0509 : 2009 CONFORMAL COATING PHOTOGRAPHIC POSTER GUIDE
    IPC A 610 HUNGARIAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC 6012 FRENCH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
    IPC 2221 FRENCH : B2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    MIL-PRF-55342 Revision H:2003 RESISTOR, CHIP, FIXED, FILM, NONESTABLISHED RELIABILITY, ESTABLISHED RELIABILITY, SPACE LEVEL, GENERAL SPECIFICATION FOR
    IPC A 610 CHINESE : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC J STD 001 TURKISH : E2010 REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 RUSSIAN : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 POLISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC A 610 TURKISH : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC J STD 609 CHINESE : A IPC/JEDEC MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES
    IPC A 610 JAPANESE : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IEC PAS 62293:2001 Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016)
    IPC A 610 RUSSIAN : D ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC A 610 VIETNAMESE : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    MIL STD 11991 : A GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES
    DD IEC/PAS 62588:2008 Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes
    IEC PAS 62647-22:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    12/30262664 DC : DRAFT APR 2012 BS EN 62588 - MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES
    IPC J STD 001 ROMANIAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
    IPC TM 650 : 0 TEST METHODS MANUAL
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