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MIL-PRF-31032-1 Revision D:2017

MIL-PRF-31032-1 Revision D:2017

Current

Current

The latest, up-to-date edition.

PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED-THROUGH HOLES, FOR SOLDERED PART MOUNTING

Available format(s)

PDF

Publisher

US Military Specs/Standards/Handbooks

1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES

Specifies the generic performance requirements for rigid, multilayered (three or more conductor layers) printed wiring boards (hereafter designated printed board) with plated holes, that will use soldering for component/part mounting.

Committee
FSC 5998
DocumentType
Standard
Pages
78
PublisherName
US Military Specs/Standards/Handbooks
Status
Current

MIL-PRF-55110 Revision H:2014 Printed Wiring Board, Rigid, General Specification for

IPC A 600 : H ACCEPTABILITY OF PRINTED BOARDS
IPC 9252 : A REQUIREMENTS FOR ELECTRICAL TESTING OF UNPOPULATED PRINTED BOARDS
IPC TM 650 : 0 TEST METHODS MANUAL
MIL-PRF-31032 Revision C:2016 Printed Circuit Board/Printed Wiring Board, General Specification for
ASTM B 567 : 1998 Standard Test Method for Measurement of Coating Thickness by the Beta Backscatter Method
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 2222 : A SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS

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PDF - English
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