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MIL R 28750 : C SUPP 1

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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RELAYS, SOLID STATE, SEALED, OPTICALLY ISOLATED, ZERO VOLTAGE TURN ON, 25 AMPERES, 250 VOLTS MAXIMUM, 45-440 HZ, POWER SWITCHING

Superseded date

01-02-1999

Published date

12-01-2013

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Specifies hermetically sealed or encapsulated solid state relays using only semiconductor and passive circuit devices.

Committee
FSC 5945
DocumentType
Standard
PublisherName
US Military Specs/Standards/Handbooks
Status
Superseded
SupersededBy

MIL S 16036 : K SWITCHGEAR, POWER, NAVAL SHIPBOARD
MIL-HDBK-217 Revision F:1991 RELIABILITY PREDICTION OF ELECTRONIC EQUIPMENT
MIL E 17807 : C ELEVATOR, WEAPON AND CARGO, ELECTROMECHANICAL (SHIPBOARD)
MIL E 917 : E ELECTRIC POWER EQUIPMENT, BASIC REQUIREMENTS (NAVAL SHIPBOARD USE)
MIL-STD-1346 Revision C:1994 RELAY, SELECTION AND APPLICATION
MIL-P-11268 Revision L:1983 PART, MATERIALS, AND PROCESSES USED IN ELECTRONIC EQUIPMENT

PPP-C-1752 Revision D:1989 CUSHIONING MATERIAL, PACKAGING, POLYETHYLENE FOAM
MIL-STD-1772 Revision B:1990 CERTIFICATION REQUIREMENTS FOR HYBRID MICROCIRCUITS FACILITIES AND LINES
ASME Y32.2 : LATEST DRAW AND TERM - GRAPHICS SYMBOLS STANDARDS - FOR ELECTRICAL AND ELECTRONIC DIAGRAMS
MIL-I-23011 Revision C:1974 IRON-NICKEL ALLOYS FOR SEALING TO GLASS AND CERAMICS
MIL-B-117G:1993 BAG, SLEEVE AND TUBING
MIL-STD-129 Revision R:2014 Military Marking for Shipment and Storage
MIL-STD-883 Revision K:2016 TEST METHOD STANDARD - MICROCIRCUITS
ASTM D 3953 : 2015 : REDLINE Standard Specification for Strapping, Flat Steel and Seals
PPP-B-636 Revision J:1981 BOX, SHIPPING, FIBERBOARD
MIL B 81705 : C BARRIER MATERIALS, FLEXIBLE, ELECTROSTATIC FREE HEAT SEALABLE
MIL-STD-2073-1 Revision E:2008 STANDARD PRACTICE FOR MILITARY PACKAGING
MIL C 17 : G CABLES, RADIO FREQUENCY, FLEXIBLE AND SEMIRIGID, GENERAL SPECIFICATION FOR
MIL-P-15047 Revision C:1971 PLASTIC MATERIAL, LAMINATED THERMOSETTING SHEETS, NYLON FABRIC BASE, PHENOLIC RESIN
MIL-P-997 Revision D:1966 PLASTIC MATERIAL, LAMINATED, THERMOSETTING, ELECTRIC INSULATION, SHEETS, GLASS CLOTH, SILICONE RESIN
MIL-STD-1686 Revision C:1995 ELECTROSTATIC DISCHARGE CONTROL PROGRAM FOR PROTECTION OF ELECTRICAL AND ELECTRONIC PARTS, ASSEMBLIES AND EQUIPMENT (EXCLUDING ELECTRICALLY INITIATED EXPLOSIVE DEVICES)
ASTM F 30 : 1996 Standard Specification for Iron-Nickel Sealing Alloys
MIL-STD-45662 Revision A:1988 CALIBRATION SYSTEMS REQUIREMENTS
MIL-M-38510 Revision J:1991 MICROCIRCUITS, SPECIFICATION FOR
MIL-STD-750 Revision F:2011 TEST METHODS FOR SEMICONDUCTOR DEVICES
MIL-STD-889 Revision C:2016 DISSIMILAR METALS
FED-STD-209 Revision E:1992 AIRBORNE PARTICULATE CLEANLINESS CLASSES IN CLEANROOMS AND CLEAN ZONES
PPP-C-1797 Revision A:1982 CUSHIONING MATERIAL, RESILIENT, LOW DENSITY, UNICELLULAR POLYPROPYLENE FOAM
MIL-R-27777 Revision B:1973 RELAY, TELEGRAPH, PASSIVE, SOLID STATE, GENERAL SPECIFICATION FOR
MIL-I-10 Revision B:1966 INSULATING COMPOUND ELECTRICAL CERAMIC CLASS 1
PPP-C-795 Revision D:1994 Cushioning Material, Closed Cell Flexible, Plastic Film
FED-STD-123 Revision H:2007 MARKING FOR SHIPMENT (CIVIL AGENCIES)
MIL-STD-1520 Revision C:1986 CORRECTIVE ACTION AND DISPOSITION SYSTEM FOR NONCONFORMING MATERIAL
MIL G 45204 : C GOLD PLATING, ELECTRODEPOSITED
MIL-STD-790 Revision G:2011 Established Reliability and High Reliability Qualified Products List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts Specifications
MIL-N-46026 Revision A:1965 NICKEL ROD AND WIRE (ROUND) (FOR ELECTRONIC USE)
MIL-STD-461 Revision G:2015 REQUIREMENTS FOR THE CONTROL OF ELECTROMAGNETIC INTERFERENCE CHARACTERISTICS OF SUBSYSTEMS AND EQUIPMENT
MIL-STD-977 Base Document:1982 TEST METHODS AND PROCEDURES FOR MICROCIRCUIT LINE CERTIFICATION
MIL-P-15037 Revision E:1965 PLASTIC SHEET, LAMINATED, THERMOSETTING, GLASS CLOTH, MELAMINE RESIN
MIL S 19500 : J SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
MIL-P-116 Revision J:1988 PRESERVATION, METHODS OF
MIL H 38534 : B (1) HYBRID MICROCIRCUITS, GENERAL SPECIFICATION FOR
MIL C 55681 : D SUPP 1 CAPACITOR, CHIP, MULTIPLE LAYER, FIXED UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
PPP-B-601 Revision H:1989 BOXES, WOOD, CLEATED PLYWOOD
MIL-STD-1346 Revision C:1994 RELAY, SELECTION AND APPLICATION
MIL R 55342 : C RESISTORS, FIXED, FILM, CHIP, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
MIL-STD-462 Revision D:1993 MEASUREMENT OF ELECTROMAGNETIC INTERFERENCE CHARACTERISTICS
MIL-STD-202 Revision H:2015 ELECTRONIC AND ELECTRICAL COMPONENT PARTS
MIL-STD-1285 Revision D:2004 MARKING OF ELECTRICAL AND ELECTRONIC PARTS
FED-STD-H28 Revision A:1994 Screw-Thread Standards for Federal Services
EIA 557 : 2006 STATISTICAL PROCESS CONTROL SYSTEMS
PPP-B-621 Revision D:1981 BOXES, WOOD, NAILED AND LOCK CORNER
ZZ-R-765 Revision E:1991 RUBBER, SILICONE; RUBBER SHEET SOLID
PPP-C-1842 Revision B:1992 CUSHIONING MATERIAL, PLASTIC, OPEN CELL (FOR PACKAGING APPLICATIONS)
MIL-STD-1189 Revision B:1989 BAR CODE SYMBOLOGY, STANDARD DEPARTMENT OF DEFENSE
MIL-M-14 Revision H:1990 MOLDING COMPOUNDS, THERMOSETTING
MIL R 28776 : C RELAY, HYBRID, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR

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