IPC J STD 609 : A
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES
Available format(s)
Hardcopy , PDF
Language(s)
English
Publisher
Superseded date
28-04-2026
Excluding VAT
Foreword
1 Scope
2 Reference Documents
3 Terms and Definitions
4 Symbols, Labels, and Marks
5 Marking/Labeling Categories
6 Component Marking and Labeling
7 PCB/Assembly Marking and Labeling
8 Marking and/or Labeling of Pb-Containing Components,
PCBs, and PCB Assemblies
9 Summary of Marking and Labeling Requirements
Annex A - Example Alloys and Associated Material Codes
Annex B - Material Code Flow Chart
Pertains to components and assemblies that contain Pb-free and Pb-containing solders and finishes. Also describes the marking of components and the labeling of their shipping containers to identify their 2nd level terminal finish or material, and applies to components that are intended to be attached to boards or assemblies with solder or mechanical clamping or are press fit.
| DevelopmentNote |
Supersedes IPC 1066 & EIA JESD 97. (11/2007) Also available in CD-ROM format. Also available in Chinese Language, See J STD 609 CHINESE. (06/2011)
|
| DocumentType |
Standard
|
| Pages |
24
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Superseded
|
| Supersedes |
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| MIL-DTL-39032 Revision E:2000 | Resistors, Packaging of |
| PD IEC/TS 62647-1:2012 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan |
| IEC PAS 62647-23:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
| GEIA HB 0005-3 : 2008 | REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
| GEIA HB 0005-2 : 2007 | TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
| GEIA STD 0006 : 2008 | REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS |
| GEIA STD 0005-1 : 2012 | PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
| NASA JSC 66491 : 2013 | STANDARD FOR JSC LEAD-FREE CONTROL PLANS (LFCP) |
| IEC TS 62647-1:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan |
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| IEC TS 62564-1:2016 | Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors |
| IEC TS 62647-23:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
| PD IEC/PAS 62686-2:2016 | Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for passive components |
| PD IEC/TS 62647-23:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
| IEC TS 62647-22:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
| IEC PAS 62647-22:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
| PD IEC/PAS 63015:2016 | Definition of “Low-Halogen” for electronic products |
| PD IEC/TS 62686-1:2015 | Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors |
| 12/30262664 DC | BS EN 62588. Marking and Labeling of Components, PCBs and PCBAs to identify lead (Pb), lead-free (Pb-free) and other attributes |
| DD IEC PAS 62647-23 : DRAFT AUG 2011 | PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES |
| PD IEC/TS 62647-22:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines |
| IPC J STD 006 : C | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| DSCC 10012 : 0 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, GENERAL DRAWING |
| DSCC 10013 : 0 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, TYPE 3 WITH PLATED-THROUGH HOLES |
| IPC 1601 CHINESE : 2016 | PRINTED BOARD HANDLING AND STORAGE GUIDELINES |
| DSCC 11006 : 0 | PRINTED WIRING BOARD, FLEXIBLE RIGID FLEX, GENERAL DRAWING |
| DSCC 10014:2012 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, TYPE 4 WITH BLIND AND BURIED VIAS |
| MSS SP-134:2025 | Valves for Cryogenic Service, Including Requirements for Body/Bonnet Extensions |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
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| IEC 61249-2-21:2003 | Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad |
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