NF EN 61191-3 : 2000
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
View Superseded by
PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
07-10-2021
12-01-2013
Contents
Clause
1. General
1.1 Scope
1.2 Classification
2. Normative references
3. Through-hole technology (THT)
4. Through-hole mounting of components
4.1 Placement accuracy
4.2 Through-hole component requirements
5. Acceptance requirements
5.1 Control and corrective actions
5.2 Through-hole component lead soldering
6. Rework of unsatisfactory solder connections
Annex A (normative) Placement requirements for through-hole
mount devices
Annex ZA Normative references to international publications
with their corresponding European publications
Gives requirements for lead and hole solder assembly. These pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that also include other relating technologies (i.e. chip mounting, surface mount, terminal mounting)
| DevelopmentNote |
Indice de Classement: C90-705
|
| DocumentType |
Standard
|
| PublisherName |
Association Francaise de Normalisation
|
| Status |
Withdrawn
|
| SupersededBy |
| Standards | Relationship |
| BS EN 61191-3:2017 | Identical |
| NBN EN 61191-3 : 1999 | Identical |
| EN 61191-3:2017 | Identical |
| I.S. EN 61191-3:2017 | Identical |
| IEC 61191-3:2017 | Identical |
| DIN EN 61191-3:2016-01 (Draft) | Identical |
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