NF EN 61249 8-8 : 1998
Current
The latest, up-to-date edition.
MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 8: TEMPORARY POLYMER COATINGS
12-01-2013
AVANT-PROPOS
INTRODUCTION
1 Domaine d'application
2 Référence normative
3 Propriétés
4 Conteneurs et leur marquage
A Tableau de conversion
ANNEXE ZA - Autres publications internationales citées dans
la présente norme avec les références des
publications européennes correspondantes
La présente spécification détaille à l'intérieur de la série CEI 61249 les exigences concernant l'homologation des revêtements amovibles de réserve de brasure. Dans cette spécification ceux-ci sont désignés par le terme masque, du fait qu'ils peuvent être aisément enlevés. Les exigences pour l'homologation des revêtements permanents de réserve de brasure en polymère sont données dans la CEI 61249-8-5 qui a été utilisée, autant que possible, comme modèle dans l'élaboration de la présente spécification.
| DevelopmentNote |
Indice de classement: C93-748 (03/2007)
|
| DocumentType |
Standard
|
| PublisherName |
Association Francaise de Normalisation
|
| Status |
Current
|
| Standards | Relationship |
| IEC 61249-8-8:1997 | Identical |
| EN 61249-8-8:1997 | Identical |
| HD 323.2.20 : 200S3 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 62326-4-1:1997 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability Detail Specification - Performance levels A, B and C |
| IEC 61189-1:1997+AMD1:2001 CSV | Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology |
| EN 61189-3:2008 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| NFC 20 720 : 87 AMD 1 1988 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TEST METHODS - TEST T - SOLDERING |
| IEC 62326-4-1:1996 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C |
| EN 61189-1 : 97 AMD 1 2001 | TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 1: GENERAL TEST METHODS AND METHODOLOGY |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
| EN 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
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