OVE/ONORM EN 61760-2 : 2007
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE
13-10-2022
12-01-2013
Diese ÖVE/ÖNORM EN beschreibt die Transport- und Lagerungsbedingungen für oberflächenmontierbare Bauelemente (SMD), die zu erfüllen sind, um eine störungsfreie Verarbeitung der oberflächenmontierbaren Bauelemente, aktive wie auch passive, sicherzustellen. (Bedingungen für Leiterplatten werden nicht berücksichtigt.) Der Zweck dieser Internationalen Norm ist, sicherzustellen, dass Anwender von SMD Produkte erhalten und lagern, die ohne Beeinträchtigung von Qualität und Zuverlässigkeit weiterverarbeitet (z. B. positioniert, gelötet) werden können. Dabei können unsachgemässer Transport und Lagerung von SMD Verschlechterungen hervorrufen und zu Problemen bei der Bestückung wie schlechter Lötbarkeit, Delaminierung und Popcorneffekten führen.
DevelopmentNote |
Supersedes ONORM OVE EN 61760-2. (05/2010)
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DocumentType |
Standard
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PublisherName |
Osterreichisches Normungsinstitut/Austrian Standards
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Status |
Superseded
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SupersededBy |
Standards | Relationship |
EN 61760-2:2007 | Identical |
IEC 61760-2:2007 | Identical |
EN 60286-5:2004/A1:2009 | PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 5: MATRIX TRAYS |
EN 60286-6:2004 | Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components |
EN 60721-3-1:1997 | Classification of environmental conditions - Part 3: Classification of groups of environmental parameters and their severities - Section 1: Storage |
EN 61340-5-1:2016/AC:2017-05 | ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS (IEC 61340-5-1:2016/COR1:2017) |
IEC TS 61340-5-2:1999 | Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide |
EN 60749 : 99 AMD 2 2001 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS |
IEC 60286-6:2004 | Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components |
IEC 60286-5:2003+AMD1:2009 CSV | Packaging of components for automatic handling - Part 5: Matrixtrays |
EN 60286-3:2013/AC:2013 | PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013) |
IEC 60721-3-2:1997 | Classification of environmental conditions - Part 3: Classification of groups of environmental parameters and their severities - Section 2: Transportation |
EN 61340-5-2:2001/corrigendum:2001 | ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE |
IEC 60286-3:2013 | Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes |
EN 60286-4:2013 | Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms |
EN 60721-3-2:1997 | Classification of environmental conditions - Part 3: Classification of groups of environmental parameters and their severities - Section 2: Transportation |
IEC 60286-4:2013 | Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms |
IEC 60721-3-1:1997 | Classification of environmental conditions - Part 3 Classification of groups of environmental parameters and their severities - Section 1: Storage |
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