SEMI 3D16 : 2016
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
SPECIFICATION FOR GLASS BASE MATERIAL FOR SEMICONDUCTOR PACKAGING
Superseded date
05-09-2022
Superseded by
Published date
01-01-2016
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Pertains to address the needs of the 3D Stacked IC (3DS-IC) industry by providing the tools needed to procure glass as base material to be used in a 3DS-IC process or in similar applications.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (11/2016)
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| DocumentType |
Standard
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| PublisherName |
Semiconductor Equipment & Materials Institute
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| Status |
Superseded
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| SupersededBy |
| SEMI M35 : 2014 | GUIDE FOR DEVELOPING SPECIFICATIONS FOR SILICON WAFER SURFACE FEATURES DETECTED BY AUTOMATED INSPECTION |
| SEMI MF533 : 2010(R2016) | TEST METHODS FOR THICKNESS AND THICKNESS VARIATION OF SILICON WAFERS |
| SEMI M59 : 2014 | TERMINOLOGY FOR SILICON TECHNOLOGY |
| SEMI E119 : JUL 2006(R2012) | MECHANICAL SPECIFICATION FOR REDUCED-PITCH FRONT-OPENING BOX FOR INTERFACTORY TRANSPORT OF 300 MM WAFERS |
| SEMI M45 : 2010(R2017) | SPECIFICATION FOR 300 MM WAFER SHIPPING SYSTEM |
| SEMI MF928 : 2017 | TEST METHOD FOR EDGE CONTOUR OF CIRCULAR SEMICONDUCTOR WAFERS AND RIGID DISK SUBSTRATES |
| SEMI MF1530 : 2007(R2018) | TEST METHOD FOR MEASURING FLATNESS, THICKNESS, AND TOTAL THICKNESS VARIATION ON SILICON WAFERS BY AUTOMATED NON-CONTACT SCANNING |
| SEMI MF1451:2007(R2019) | TEST METHOD FOR MEASURING SORI ON SILICON WAFERS BY AUTOMATED NON-CONTACT SCANNING |
| SEMI 3D7 : 2013(R2019) | GUIDE FOR ALIGNMENT MARK FOR 3DS-IC PROCESS |
| SEMI MF2074 : 2012 (R2018) | GUIDE FOR MEASURING DIAMETER OF SILICON AND OTHER SEMICONDUCTOR WAFERS |
| SEMI M31 : 2008 | MECHANICAL SPECIFICATION FOR FRONT-OPENING SHIPPING BOX USED TO TRANSPORT AND SHIP 300 MM WAFERS |
| SEMI 3D12 : 2015 | GUIDE FOR MEASURING FLATNESS AND SHAPE OF LOW STIFFNESS WAFERS |
| SEMI MF1152 : 2016 | TEST METHOD FOR DIMENSIONS OF NOTCHES ON SILICON WAFERS |
| SEMI M40 : 2014 | GUIDE FOR MEASUREMENT OF ROUGHNESS OF PLANAR SURFACES ON POLISHED WAFERS |
| SEMI MF657 : 2007E | TEST METHOD FOR MEASURING WARP AND TOTAL THICKNESS VARIATION ON SILICON WAFERS BY NONCONTRAST SCANNING |
| SEMI 3D11 : 2014 | TERMINOLOGY FOR THROUGH GLASS VIA AND BLIND VIA IN GLASS GEOMETRICAL METROLOGY |
| SEMI T7 : 2016 | SPECIFICATION FOR BACK SURFACE MARKING OF DOUBLE-SIDE POLISHED WAFERS WITH A TWO-DIMENSIONAL MATRIX CODE SYMBOL |
| SEMI MF671:2012 | TEST METHOD FOR MEASURING FLAT LENGTH ON WAFERS OF SILICON AND OTHER ELECTRONIC MATERIALS |
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