SEMI M24 : 2007
Current
Current
The latest, up-to-date edition.
SPECIFICATION FOR POLISHED MONOCRYSTALLINE SILICON PREMIUM WAFERS
Published date
12-01-2013
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Specifies requirements for virgin silicon premium wafers with nominal diameter from 150-300 mm used for particle counting, metal contamination monitoring, and measuring pattern resolution in the photolithography process in semiconductor manufacturing.
DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001) Also available in CD-ROM. (02/2007)
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DocumentType |
Standard
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PublisherName |
Semiconductor Equipment & Materials Institute
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Status |
Current
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SEMI M8 : 2012 | SPECIFICATION FOR POLISHED MONOCRYSTALLINE SILICON TEST WAFERS |
SEMI M38 : 2012(R2018) | SPECIFICATION FOR POLISHED RECLAIMED SILICON WAFERS |
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SEMI M18 : 2012 | GUIDE FOR DEVELOPING SPECIFICATION FORMS FOR ORDER ENTRY OF SILICON WAFERS |
SEMI M49 : 2016 | GUIDE FOR SPECIFYING GEOMETRY MEASUREMENT SYSTEMS FOR SILICON WAFERS FOR THE 130 NM TO 16 NM TECHNOLOGY GENERATIONS |
SEMI M59 : 2014 | TERMINOLOGY FOR SILICON TECHNOLOGY |
SEMI M45 : 2010(R2017) | SPECIFICATION FOR 300 MM WAFER SHIPPING SYSTEM |
SEMI M18 : 2012 | GUIDE FOR DEVELOPING SPECIFICATION FORMS FOR ORDER ENTRY OF SILICON WAFERS |
SEMI T3 : 2013 | SPECIFICATION FOR WAFER BOX LABELS |
SEMI T7 : 2016 | SPECIFICATION FOR BACK SURFACE MARKING OF DOUBLE-SIDE POLISHED WAFERS WITH A TWO-DIMENSIONAL MATRIX CODE SYMBOL |
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